Lunch & Learn with X-FAB
Join X-FAB for a FREE Lunch & Learn Technical Seminar on how we can support & manufacture your semiconductor products with our broad range of More than Moore technologies ranging from advanced CMOS & BiCMOS to specialty processes such as SOI, MEMS and BCD technologies.
PRESENTATION I (by Iain Rutherford)
Topic: SENSE – Manufacturing MEMS for the Sensing Revolution
MEMS sensors increasingly are being used in electronic applications to sense the world around us, and more uses are being discovered every day. For example, accelerometers and gyroscopes sense movement for games, phones and automobiles. Pressure sensors help monitor tires, motor engines, blood and the weather. This overview presentation reviews X-FAB’s MEMS foundry services including processing capabilities for its own technologies and for customer-specific devices. It discusses how X-FAB manufactures MEMS using bulk and surface micro-machining – including CMOS integration – and the next step X-FAB has taken toward 200mm wafer processing.
PRESENTATION II (by Olaf Zinke)
Topic: PROCESS – Signal Conditioning Technologies for Sensing Applications
The increased number of sensors in applications today heightens the necessity for signal-conditioning technologies to handle sensor output signals such as AC or DC voltage or current, electric charge and frequency information. Such signal conditioning can include amplification, filtering, converting, range matching, isolation and other processes required to make sensor output suitable for processing after conditioning, such as AD conversion. This presentation covers a broad range of signal conditioning process technology requirements including low noise or matching behavior as well as OTP and trimming solutions. It also discusses integrated Hall sensors solutions.
PRESENTATION III (by Konrad Bach)
Topic: ACTUATE - Integrated Solutions for Actuators & Power Management
Increased usage of sensor applications goes hand-in-hand with the usage of actuator such as actuators are bubble jet or piezo inkjet print heads, integrated micromirrors or microfluidic devices and piezo electric actuators. This increase requires technologies to integrate those actuators in silicon or at least to provide integrated actuator drivers. All of the sensors and actuators also require efficient power management solutions, especially for mobile applications.
This presentation covers a broad range of solutions for actuators and integrated power management applications. It covers many voltage ranges up to 100V, explores how to deal with high temperature sometimes found in those applications. The seminar also reviews X-FAB's non-volatile data and program storage options as well as trimming solutions are being reviewed. Finally it discusses an example solenoid driver application.
Detail:
- Date: 17 September 2010 (Wednesday)
- Time: 10.00am - 2.30pm
- Venue: Novotel Ambassador Gangnam, Seoul, Korea
Agenda:
10.00am – 10.30am Registration
10.30am – 11.00am Introduction
11.00am – 11.45am Presentation 1
11.45am – 11.50am Q&A
11.50am – 12.05pm Coffee Break
12.05pm – 12.50pm Presentation 2
12.50pm – 12.55pm Q&A
12.55pm – 1.40pm Presentation 3
1.40pm – 1.45pm Q&A
1.45pm – 2.00pm Closing
2.00pm – 2.30pm Lunch & Networking
REGISTER TODAY
Seating is limited, so register today for this FREE event by sending email to: X-FABKorea(at)xfab.com
