• SEM / EDX
  • Cross section
  • Grinding
  • Package opening
  • Layer removal
  • Spreading resistance
  • Optical Microscope
  • FIB
  • OBRICH
  • SIMS, AES
  • EMMI
  • E-Beam
  • LCA - probe
  • TEM / EDX
 
 

© X-FAB Semiconductor Foundries 2013