NEWS
5월 2006 X-FAB Partners with Akustica to Deliver World`s First CMOS MEMS Single-Chip Microphones
X-FAB Partners with Akustica to Deliver World`s First CMOS MEMS Single-Chip Microphones X-FAB to provide foundry services for Akustica's family of CMOS MEMS silicon microphone chips Erfurt, Germany and Pittsburgh, PA; May 31, 2006: Akustica, Inc., a pioneer in acoustic system-on-chip solutions,
5월 2006 X-FAB Reduces Die Size with New Trench-Isolated SOI CMOS Technology
X-FAB Semiconductor Foundries AG, one of the world's leading analog mixed-signal semiconductor foundries, today announced XT06, its new 0.6 micrometer Silicon On Insulator (SOI) CMOS technology with trench isolation. This innovative process technology delivers X-FAB's modular, flexible 0.6
