Multi Project Wafer Schedule 2010

The timescales indicated below include the preparation of data from the different submissions,
fabrication with the maximum amount of process options, and individual dicing. To find out the
timescales of standard engineering lots please contact your local sales and support office.

 

X-CMOS 0.18 µm (*)

Process

Tape In

Samples Out

XH018

13-Nov-09

17-Mar-10

XH018

08-Jan-10

28-Apr-10

XH018

09-Apr-10

28-Jul-10

XH018

09-Jul-10

27-Oct-10

XH018

08-Oct-10

26-Jan-11



X-CMOS 0.18 µm (*)

Process

Tape In

Samples Out

XC018

04-Dec-09

02-Apr-10

XC018

19-Feb-10

28-May-10

XC018

07-May-10

13-Aug-10

XC018

06-Aug-10

12-Nov-10

XC018

05-Nov-10

11-Feb-11



X-CMOS 0.25 µm (*)

Process

Tape In

Samples Out

0.25 µm FC

On request 



X-CMOS 0.35 µm (*)

Process

Tape In

Samples Out

XH035

27-Nov-09

26-Mar-10

XH035/XA035 (only MOS flow) 

22-Jan-10

07-May-10

XH035 (only MOSLL/MOSLT flow)

19-Mar-10

02-Jul-10

XH035/XA035 (only MOS flow)

21-May-10

03-Sep-10

XO035

25-Jun-10

13-Sep-10

XH035/XA035 (only MOS flow)

23-Jul-10

05-Nov-10

XH035 (only MOSLL/MOSLT flow)

24-Sep-10

07-Jan-11

XH035/XA035 (only MOS flow)

26-Nov-10

11-Mar-11



X-CMOS 0.6 µm (*)

Process

Tape In

Samples Out

XC06

16-Oct-09

11-Feb-10

XC06

08-Jan-10

22-Apr-10

XC06

09-Apr-10

22-Jul-10

XC06

09-Jul-10

21-Oct-10

XC06

08-Oct-10

22-Jan-11



X-BiCMOS 0.6 µm (*)

Process

Tape In

Samples Out

XB06

20-Nov-09

04-Mar-10

XB06

12-Feb-10

20-May-10

XB06

14-May-10

19-Aug-10

XB06

13-Aug-10

18-Nov-10

XB06

12-Nov-10

17-Feb-11



X-SOI Trench Isolated CMOS 0.6 µm (*)

Process

Tape In

Samples Out

XT06

22-Jan-10

22-May-10

XT06

30-Jul-10

25-Nov-10



X-CMOS 0.8 µm (*)

Process

Tape In

Samples Out

CX08HW

05-Feb-10

06-May-10

CX08HW

10-Sep-10

09-Dec-10



X-SOI CMOS 1 µm (*)

Process

Tape In

Samples Out

XI10

26-Feb-10

18-May-10

XI10

27-Aug-10

16-Nov-10



X-DIMOS 1.0 µm (**)

Process

Tape In

Samples Out

XDH10/XDM10

12-Mar-10

17-Jun-10

XDH10/XDM10

22-Oct-10

27-Jan-11



SOI-based Surface-Micro-Machining-Technology for Inertial Sensors (**)

Process

Tape In

XM30

on request

 


Notes:

(*) highest process extension, all other sub variants of this process family included
(**) only dice in wafflepack possible
All changes to above schedule will be automatically updated on this web page only.
Please contact X-FAB before tape-in: sifo(at)xfab.com