Multi Project Wafer Schedule 2012

The timescales indicated below include the preparation of data from the different submissions, fabrication with the maximum amount of process options, and individual dicing. To find out the timescales of standard engineering lots please contact your local sales and support office.

If you cannot find a suitable MPW shuttle in the schedule below, please contact your local sales manager who will check the possibility of additional MPW runs that are available on request.

X-CMOS 0.18 µm (*)

Process	Tape In	Samples Out
XH018	25-Nov-11	12-Feb-12
XH018	06-Jan-12	06-Apr-12
XH018	09-Mar-12	08-Jun-12
XH018	11-May-12	10-Aug-12
XH018	06-Jul-12	15-Oct-12
XH018	14-Sep-12	14-Dec-12
XH018	23-Nov-12	11-Fab-13

Process	Tape In	Samples Out
XP018	10-Feb-12	30-Apr-12
XP018	20-Apr-12	09-Jul-12
XP018	20-Jun-12	08-Oct-12
XP018	09-Nov-12	28-Jan-13

X-CMOS 0.35 µm (*)

Process	Tape In	Samples Out
XA035	16-Dec-11	28-Feb-12
XA035	20-Jan-12	04-Apr-12
XA035	25-May-12	08-Aug-12
XA035	28-Sep-12	11-Dec-12
Additional runs available on request

Process	Tape In	Samples Out
XH035¹	16-Dec-11	28-Feb-12
XH035¹	20-Jan-12	04-Apr-12
XH035¹	25-May-12	08-Aug-12
XH035¹	28-Sep-12	11-Dec-12
Additional runs available on request
¹(usable modules equivalent to XA035 family)

X-CMOS 0.6 µm (*)

Process	Tape In	Samples Out
XC06	06-Jan-12	05-Apr-12
XC06	08-Jun-12	06-Sep-12
XC06	12-Oct-12	10-Jan-13

X-DIMOS 1.0 µm (*)

Process	Tape In	Samples Out
XDH10/XDM10	16-Mar-12	16-May-12
XDH10/XDM10	21-Sep-12	21-Nov-12

Notes:

(*) highest process extension, all other sub variants of this process family included. Only dice in wafflepack possible.
All changes to above schedule will be automatically updated on this web page only.
In order to ensure that your device can be placed on the MPW we encourage you to contact your local sales and support office or you send an email to: sifo(at)xfab.com