Qualification & Reliability

To ensure best quality and reliability performance of all its technologies, X-FAB opted for an integrated, process-oriented approach in which quality is considered as a built-in product feature. The X-FAB Quality Management System thus systematically emphasizes quality within every process, at every stage of product development through manufacturing. Continuous improvement of the process capability enables X-FAB to provide products of ever higher quality delivered in a timelier manner to its customers.

X-FAB Qualification Procedures

Continuous production of durable products under defined conditions requires state-of-the-art qualification and monitoring procedures to be implemented both for technology development and for any changes made. As a part of its Quality Management System, X-FAB has installed such a qualification and monitoring system for all its technologies. From the initial process development to fabrication, testing and delivery, quality at X-FAB is built-in and assured through stringent Statistical Process Control (SPC) monitoring of fabrication processes, materials inspections, Wafer Level Reliability (WLR) tests, new technology qualifications, reliability monitoring of technologies and strict change control management.

The general rules, requirements and responsibilities as well as the test methods to be used for the qualification of semiconductor technologies within the X-FAB group are described in a General Procedure document. The procedures and practices it prescribes are based on the following standards:

  • JP-001 FOUNDRY PROCESS QUALIFICATION GUIDELINES
  • AEC-Q-100-Rev F STRESS TEST QUALIFICATION FOR INTEGRATED CIRCUITS
  • MIL-STD-883G TEST METHOD STANDARD MICROCIRCUITS

AECQ-100 / JP-001