In the semiconductor and electronics industry, thorough failure analysis is a vital tool for the development of new products and the improvement of existing ones. X-FAB puts a lot of emphasis on systematically and speedily determining the cause of failure, collecting and analyzing data, and developing conclusions to eliminate the failure mechanism - in a constant endeavor to deliver reliable, best-quality products that fully satisfy its customers' expectations.
X-FAB's Failure Analysis encompasses all the stages of the product development and manufacturing process. It provides safe and fast root cause identification for:
- Fab-process issues
- Process Control Monitor (PCM) issues
- Failed devices
- Low yield issues
and supports qualification for:
- New processes
- New materials
- New tools
- Tool extension.