19 entries, filtered by: Sensors
Published: December 2012

We present a method for producing monolithically integrated CMOS optical filters with different and customerspecific responses. The filters are constituted by a Fabry-Perot resonator formed by two Bragg mirrors separated by a patterned cavity. The filter response can be tuned by changing the geometric parameters of the patterning, and consequently the cavity effective refractive index. In this way, many different filters can be produced at once on a single chip, allowing multichanneling. The filter has been designed, produced, and characterized. The results for a chip with 24 filters are presented.


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Published: April 2013

In this paper a modified MEMS foundry process allowing the production of 3D inertial sensors, such as accelerometers, gyroscopes and combinations, is introduced. The new MEMS process is suitable for a wide range of applications that use 3D accelerometers or gyroscopes. One-axis and three-axis designs can be produced with the same process, and the fabrication of complex inertial measurement units, in particular, the assembly process, is simplified.


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Published: May 2013

The filters are constituted by a Fabry-Perot resonator formed by two Bragg mirrors separated by a patterned cavity. The filter response can be tuned by changing the geometric parameters of the patterning, and consequently the cavity effective refractive index. In this way, many different filters can be produced at once on a single chip, allowing multichanneling. The filter has been designed, produced, and characterized. The results for a chip with 24 filters are presented.


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Published: January 2010

Get an overview of the optical functions and features available as part of X-FABs More-than-Moore technology offering, including the impacts on spectral sensitivity, signal bandwidth, and noise margins. Explore what you need to consider when starting to design your optical product.


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Published: October 2010

In the past five years we have seen a huge step in the evolution of MEMS applications. Some may even call it a revolution. Traditionally, Inkjet printer heads and automotive applications have dominated MEMS volume production. Today, demand for MEMS is particularly high in the consumer and mobile sector with further applications appearing every day. Part of this MEMS revolution has been the changing requirements for associated ASIC CMOS intelligence. Many manufacturers who currently use discrete MEMS devices are now seeing the benefits of integrated CMOS.


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Published: December 2010

This free webinar introduces X-FAB’s Hall effect sensor device that detects and measures magnetic fields directly on the chip, making magnetic field-sensing design much faster. You’ll learn how the Hall sensor element – available as a completely characterized building block in X-FAB’s 0.18 micrometer modular high-voltage technology, XH018 – can be combined with other features of the XH018 process to enable a broad range of applications. For example, contactless detection or measurement of magnetic fields, and applications in which a magnetic field is used for indirect measurement of distance, position, rotational angle, speed or an electric current.


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Published: June 2012

Sensors are everywhere, serving as an interface between our analog world and the digital world of data processing in electronic systems. Is your design challenge – making sensor output signals available to complex digital systems – further complicated by the need for low noise, temperature-dependent behavior and non-linear effects? If you are looking for solutions for low noise amplification and temperature drift, non-linearity or signal offset compensation, don’t miss this free webinar. It helps designers select the right technology for low-noise and high-precision sensor interfaces. You’ll get tips for achieving excellent matching for robust circuits, and see how X-FAB’s sophisticated modelling enables first-time-right analog and mixed-signal designs.


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Published: September 2012

Ever been stuck with the “one product, one process” rule when what you really needed was access to a world-class quality process for multiple applications? Not anymore.
X-FAB is presenting a webinar on its open-platform MEMS inertial sensor processes including its new 3D inertial sensor technology. Learn how you can use X-FAB’s design partner, MicroMountains Applications, or apply your own design to X-FAB’s ready-to-use processes to run high or low wafer volumes without long and costly process development. Find out how X-FAB can help you get to market faster and secure high-quality manufacturing for inertial sensors. You’ll get an overview of both inertial sensor technologies and IP blocks from X-FAB, as well as design and test support from MicroMountains Applications.


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Published: May 2013

What happens when optical signals are converted to electrical signals? Focusing on the optical to electrical conversion process, this webinar sheds some light on the basics of light interaction from reflection, transmission, polarization and refraction to absorption with semiconductors devices. It explores electrical fields, recombination and lifetime, doping profiles, band structures and pn-junctions to determine what happens when light has been converted into electron-hole pairs. This webinar provides a solid overview of passive and active optical sensor elements manufactured in a mixed-signal CMOS process or added during post processing


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