19 entries, filtered by: Sensors
Published: July 2013

XDH10 is X-Fab´s dielectric trench insulated smart power technology. Main target applications are analog switch ICs, driver ICs for capacitive, inductive and resistive loads and EL / piezo driver ICs for applications using 220V net supply. The typical breakdown voltage of the HV DMOS devices is >350V or >650V. The modular process combines DMOS, bipolar and CMOS processing steps that are compatible with dielectric insulation to provide a wide variety of MOS and bipolar devices with different voltage levels within a dielectric bi-directional high voltage trench insulation on the same die.


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Published: April 2013

In this paper a modified MEMS foundry process allowing the production of 3D inertial sensors, such as accelerometers, gyroscopes and combinations, is introduced. The new MEMS process is suitable for a wide range of applications that use 3D accelerometers or gyroscopes. One-axis and three-axis designs can be produced with the same process, and the fabrication of complex inertial measurement units, in particular, the assembly process, is simplified.


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Published: May 2013

The filters are constituted by a Fabry-Perot resonator formed by two Bragg mirrors separated by a patterned cavity. The filter response can be tuned by changing the geometric parameters of the patterning, and consequently the cavity effective refractive index. In this way, many different filters can be produced at once on a single chip, allowing multichanneling. The filter has been designed, produced, and characterized. The results for a chip with 24 filters are presented.


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Published: December 2012

We present a method for producing monolithically integrated CMOS optical filters with different and customerspecific responses. The filters are constituted by a Fabry-Perot resonator formed by two Bragg mirrors separated by a patterned cavity. The filter response can be tuned by changing the geometric parameters of the patterning, and consequently the cavity effective refractive index. In this way, many different filters can be produced at once on a single chip, allowing multichanneling. The filter has been designed, produced, and characterized. The results for a chip with 24 filters are presented.


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Published: February 2012

Moore’s law has been a strong influence on mainstream microelectronics over the past few decades, where the trends of decreasing feature size and increasing transistor count have driven the semiconductor industry forward. This philosophy has worked very well for memories and microprocessors in the digital world. Additional analog functions, by interfacing with the physical world, enable cost-optimized and value-added system solutions.


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Published: February 2012

PIN photodiodes are often used in optical integrated circuits. Although they can feature a very good RF-performance, this can be effected by the optical power density of the incident light. The influence of this effect on the RF-performance of PIN photodiodes is described. When a critical optical power density in the epi-layer is exceeded the 3dB frequencies are cut off. An analytical equation is derived to describe the effect. The results are compared to RF measurements and verified by numerical simulation.


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Published: March 2012

X-FAB, a pure play foundry, has already extensive experience in volume production of monolithic integrated MEMS devices. The idea of combining CMOS and MEMS processes to obtain monolithic integrated sensor solutions is a logical, consequent step following the “More than Moore” strategy.


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Published: June 2011

In this paper, micromachined acceleration sensors as ready-to-use Intellectual-Property-Blocks (IP-Blocks) are introduced. These standard elements are available for a special surface micromachining foundry technology. They are ready to use, characterized and qualified design elements, which can be customized by changing the peripheral elements such as bond pads, and allow the fast prototyping and production start of high-performance inertial sensors.


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Published: January 2011

Miniaturized video endoscopes with an imager located at the distal end and a simplified opto-mechanical layout are presented. They are based on a CMOS imager with 650 x 650 pixels of 2.8 μm pitch and provide straight view with 75° and 110° field of view at f/4.3. They have an outer diameter of 3 mm including the shell and a length of approx. 8 mm. The optics consist of polymer lenses in combination with a GRIN and a dispensed lens. Using a simple flip chip assembly, optical axis alignment better than 10 μm and a contrast of 30 % at 90 LP/mm was achieved. The 75° FOV system was sealed at the front window using a solderjetting technology, providing 10-9 mbar*l/s leakage rates even after several autoclave cycles.


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Published: January 2011

Visualization is still the most important tool in medical diagnostics to allow for the physician, in combination with their medical knowledge, to detect diseases within the human body and choose healing treatments in order to enable recovery. For minimal invasive surgical operations that use endoscopic tools, imaging camera modules that have both a small volume and a good resolution are necessary to ensure the success of the surgical treatment.
Microsystem technologies now allow for the direct integration of imaging optics and sensors in a system.


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