23 entries, filtered by: Wafer Manufacturing
Published: May 2004

This paper reports on glass frit wafer bonding, which is a universally usable technology for wafer level encapsulation and packaging. After explaining the principle and the process flow of glass frit bonding, experimental results are shown. Glass frit bonding technology enables bonding of surface materials commonly used in MEMS technology. It allows hermetic sealing and a high process yield. Metal lead throughs at the bond interface are possible, because of the planarizing glass interlayer. Examples of surface micromachined sensors demonstrate the potential of glass–frit bonding.

Published: October 2003

The importance of surface micromachining processes has increased over the last few years. After the fundamental problems of these technologies have been solved in research institutes, surface micromachined components now arrive in industrial production, e.g. inertial sensors for automotive applications. In comparison to the classical bulk micromachined components, technologies based on surface micromachining provide a wide range of advantages.

Published: September 2002

Wafer bonding is an basic process in nearly all technologies for industrial MEMS production. To the one wafer bonding is used to pre-process substrates with buried layers, to make special micromachining processes possible. On the other hand wafer bonding is necessary for zero level packaging, the encapsulation and sealing of free moveable structures and cavities on wafer level. The wafer bonding steps of industrial used technologies have to be very reproducible and safer to ensure an economical use by sufficient high yield.