30 entries, filtered by: Anja Noack
Published: April 2010

The integration of full custom analog circuitry into a silicon chip, to provide cost-effective products, requires a full understanding of the process architecture and uses completely different methods compared with those used for digital designs. This webinar briefly covers the digital design arena before entering into in-depth discussion of analog layout techniques. It explores the integration of X-FAB-supported primitive devices into complex integrated chips in detail, including diffusions, wells and associated layers that can be merged. The session also covers derivation of "well" combinations from the design layers, and gives guidelines for high-voltage interconnects across these well regions to avoid parasitic leakage paths.


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Published: April 2010

The exponential growth of opto-electronic applications such as digital cameras and mobile phones during the past few years has followed the same Moore’s Law scenario as memories and digital gates did in the past. These low-cost, high-volume applications require highly specialized fabs and processes to achieve the lower node size that allows for higher pixel count and higher resolution. Moore’s Law works very well for these high-volume applications. However, it falls short for several other applications that require the integration of various opto-sensitive components. These applications might have varying technical requirements for sensitivity, supported wavelength, noise and bandwidth; and commercial volume requirements spanning from low to high. In addition, many Silicon on Chip (SoC) solutions also require multiple analog functions, including opto-electronic sensors. Highly specialized fabs that follow Moore’s Law simply lack the flexibility to support all of these different requirements.


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Published: January 2010

Get an overview of the optical functions and features available as part of X-FABs More-than-Moore technology offering, including the impacts on spectral sensitivity, signal bandwidth, and noise margins. Explore what you need to consider when starting to design your optical product.


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Published: November 2009

Long-term functionality of integrated circuits (ICs) is based on the reliable operation of each component. Semiconductor device reliability within an IC is dependent on the specific stress mission profile of the ICs' intended application and its operating conditions. Shrinking primitive device dimensions and extended operating conditions compound the environmental challenges that designers face in trying to predict chip reliability.


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Published: October 2009

At high temperature, designers are faced with additional technological and design challenges. These issues and how to address them are discussed in this presentation. The webinar looks at X-FAB's high temperature solutions, in particular its latest High Temperature Modular CMOS process (XA035), a comprehensive CMOS offering with High Voltage (HV), RF, and EEPROM integration that is suitable for temperatures up to 175C. The presentation also covers high temperature modelling, application specific reliability and design for reliability.


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Published: October 2009

X-FAB steps beyond logic and memory scaling to deliver “More than Moore” value for customers. Instead of following Moore’s Law, X-FAB integrates technology features that interact with the analog world, and provides a comprehensive design ecosystem. It includes services and tools for developing diversified power/HV, MEMS, opto and analog products; a 24-hour technical hotline service; a portfolio of technically mature, extensive libraries and IP; a broad spectrum of primitive devices; and flexible prototyping options – all backed by X-FAB’s 15 years of solid analog/mixed-signal foundry expertise.


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Published: October 2009

In this paper we describe a novel tool for modeling the fabrication of MEMS and semiconductor devices, and show some examples of its application in the MEMS foundry business. The tool allows an accurate visualization of the step-by-step crreation of the final 3-D device geometry by using the 2-D layout and a description of the fabrication process.


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Published: March 2009

The analog foundry business is not just a fad. Many logic foundries are seriously trying to move into this space. However, their transformation requires a change from being contract manufacturers that provide capacity and compete on the cost side to becoming a true provider of feature-rich process technologies with modular front and back ends and comprehensive process characterization. Also, they must offer a complete analog design ecosystem including libraries, analog IP and lots of design support – complicated by the absence of standards. Such capabilities would enable customers to reuse their analog IP across different applications and various technology platforms. This article explores barriers to such a transformation near-term.


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Published: February 2009

This opinion piece analyzes the dire dilemma many IDMs face today, explains typical symptoms and reactions, and shows possible strategies out of a death spiral. It highlights why consolidation is inevitable for many players, and how pro-active consolidation can increase the number of options available and help IDMs avoid falling into the “too little too late” trap. Specifically, it covers: Current economic conditions and consequences for IDMs; Implications of competitive and financial pressure faced by IDMs; Consolidation and other strategic options, and their implementation; Risks of waiting too long; Potential role of foundries in consolidation and moving forward.


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Published: September 2005

This paper presents the results of a three and a half year R&D project for low cost micromachined gyroscopes. As starting point of this work the application requirements of enhanced automotive applications such as Advanced Driving Assistant Systems (ADAS) are given. Based on these demands the sensor development is carried out.


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