7 entries, filtered by: Stefanie Berneck
Published: February 2016

Elevated levels of integration combined with growing demands for greater cost effectiveness in electronic system implementations (from automotive right through to consumer applications) are increasing the need for IC electro-static discharge (ESD) robustness at the system level. System level ESD is a concern when any IC pin is directly connected to the “outer world”. These external pins have to be able to withstand high energy ESD pulses or else the system's long term operation could be put at risk.
In the latest of its series of informative webinars, X-FAB will discuss the implementation of ESD protection regarding system-level ESD and high energy ESD pulses. It will cover the difference between component and system-level ESD protection, provide insights on how to apply characterization methods such as the Human Metal Model (HMM) and Long-Duration Transmission Line Pulsing (LD-TLP). The presenter will also share best practices for safeguarding against system-level ESD and high energy ESD pulses

Published: November 2015

Image sensors are used more and more in daily life, not only in mobile phones, cars and computers, but also in areas such as medical, industrial and scientific applications. There are various challenges in pixel design, and especially so for large 4 transistor pixels which are necessary for high speed applications.
This webinar will give practical suggestions on the design of three- and four transistor pixels. It will provide some tips how to improve the speed of large pixels and generally on how to optimize designs that require large silicon areas. You will also receive information about X-FAB’s newly released 0.18µm process platform XS018 which is optimized for image sensor applications and comes with features such as a pinned photo diode for 4 transistor pixel designs and low dark current.

Published: October 2015

Low-noise design is one of many challenging tasks for mixed-signal designers. Knowing how to reduce low-frequency noise is crucial for achieving an optimal signal-to-noise ratio. This webinar presents a short overview of the various noise types in MOSFETs and explains how they relate to typical devices in circuit designs. It also explores methods for achieving an accurate simulated noise model – another essential consideration for first-time-right low-noise designs. X-FAB strongly emphasizes the accuracy of the noise characterization and the models used to depict transistor behavior across different conditions. X-FAB also factors in how special low-noise devices used at critical circuit points can influence total noise performance. This webinar showcases application examples, provides valuable information about X-FAB's new low-noise CMOS devices and highlights the advantages of using these devices in your design.

Published: June 2015

Reducing power consumption is unquestionably a top priority for analog/mixed-signal designs due to growing demand for battery-powered mobile applications. Responding to this need, X-FAB will offer a free webinar worldwide. This webinar explains how a unique combination of technology – a CPF/UPF (Common / Unified Power Format) design specification and X-FAB’s digital standard cell libraries – makes low-power designs more reliable and reusable.
Come find out how to prepare and apply low-power design specifications with CPF and UPF standards that can help shorten design cycles and reduce errors at each design stage. Also learn how X-FAB’s digital standard cells with multi-voltage/ power shut-off are implemented, and how they work together with a power aware tool chain to enhance low power design flows.
X-FAB’s reference kit supports fast and easy adoption of such power aware design flows by providing a realistic design and detailed documentation.

Published: May 2015

With 2015 designated as “Year of the Light” by UNESCO, X-FAB will reflect this theme with a free webinar in May about its integrated photo diodes that span the light spectrum from ultra-violet to infra-red. Come learn the challenges of supporting all parts of the spectrum with highly sensitive photo diodes. See how various photo diode structures compare in terms of light sensitivity, dark current and capacitance. Find out how to select the right devices for your optical sensor applications.

Published: July 2014

To meet stringent quality requirements like 0 ppm, it's essential to build in robust quality and verify it during product design development. This webinar will review the impact of manufacturing variations and tolerances in semiconductor processes for zero-failure-quality targets. It will introduce countermeasures like six-sigma design practice, design centering, robustness indicator figures (RIF) and statistical reliability modeling. Quality verification and robustness validation concepts will be discussed, as well as selected quality assurance methods that can be applied in the manufacturing chain.    

Published: June 2014

First-time-right in analog design depends not only on proper consideration of process variations and design sensitivities but also on device reliability. Device aging can jeopardize performance and long-term product success and therefore should be taken into account as early as possible in the development. This webinar provides an overview of reliability physics and considerations and gives guidance on reliability conscious circuit design. Critical issues are discussed and future options for a reliability-aware design flow are indicated.