11月 2011

X-FAB Extends 0.18 Micrometer Technology Platform to Address Energy Efficiency Applications

New 60V capability in combination with eFlash enables new generation of power management applications for smart power control SoCs

 
10月 2011

CEITEC S.A. Announces Volume Production of the Chip do Boi Device

RFID Device becomes Brazils First Homegrown Chip to Reach Mass Manufacturing at X-FAB

 
10月 2011

X-FAB and Senodia Bring MEMS Gyroscopes to China

Senodia selects X-FAB as MEMS foundry for high-volume production of single- and 3-axis gyroscopes

 
10月 2011

X-FAB Qualifies Cadence Physical Verification System for All Process Nodes

Customers of Leading Mixed-Signal Foundry Group Reap Benefits of In-Design Physical Verification Integrated with Cadence Encounter and Virtuoso Technologies

 
9月 2011

X-FAB がパワーマネージメント向けに高温プロセスを拡張

XA035 は、動作電圧100Vと動作温度175℃の組み合わせを可能とする初めてのプロセスで、ハイブリッドや電気自動車向けの新世代ICの製造を可能にします。

 
8月 2011

X-FAB and Micronas join in strategic partnership

Collaboration as foundry and technology partners for the 0.18 µm high-voltage CMOS process with embedded flash results in Micronas acquiring a stake in X-FAB

 
7月 2011

X-FAB Adds eFlash to High-Voltage 0.18 Micrometer Foundry Offering

XH018 eFlash solution delivers industry’s most cost-effective combination of high voltage and embedded flash for complex SoCs

 
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