Multi Project Wafer Schedule 2016 / 2017

The timescales indicated below include the preparation of data from the different submissions, fabrication with the maximum amount of process options, and individual dicing. To find out the timescales of standard engineering lots please contact your local sales and support office.

If you cannot find a suitable MPW shuttle in the schedule below, please contact your local sales manager who will check the possibility of additional MPW runs that are available on request.

X-CMOS 0.18 µm (*)

ProcessTape-inData ReleaseSamples Out
XH01827-Jun-1611-Jul-1607-Nov-16
XH01805-Sep-1619-Sep-1616-Jan-17
XH01807-Nov-1620-Nov-1620-Mar-17
XH01804-Jan-1718-Jan-1731-May-17
XH01808-May-1722-May-1702-Oct-17
XH01804-Aug-1718-Aug-1729-Dec-17
XH01813-Nov-1727-Nov-1709-Apr-18
Top metal layers restriction for XH018 MPW runs:
4 Metal Layers: only METMID allowed; MIM or MIMH are optional modules
6 Metal Layers: METMID or METTHK allowed; MIM or MIMH are optional modules
ProcessTape-inData ReleaseSamples Out
XP01824-Oct-1607-Nov-1627-Feb-17
XP01813-Feb-1727-Feb-1703-Jul-17
XP01819-Jun-1703-Jul-1706-Nov-17
XP01823-Oct-1706-Nov-1712-Mar-18
Top metal layers restriction for XP018 MPW runs:
4 Metal Layers: only METMID allowed; MIM or MIMH are optional modules
6 Metal Layers: METMID or METTHK allowed; MIM or MIMH are optional modules
ProcessTape-inData ReleaseSamples Out
XT01823-May-1606-Jun-1611-Nov-16**
XT01826-Sep-1610-Oct-1617-Mar-17**
XT01831-Jan-1714-Feb-1718-Jul-17**
XT01827-Mar-1710-Apr-1725-Sep-17**
XT01822-May-1705-Jun-1720-Nov-17**
XT01824-Jul-1707-Aug-1722-Jan-18**
XT01802-Oct-1716-Oct-1702-Apr-18**
**THKCOP module is not available for this MPW run.
Top metal layers restriction for XT018 MPW runs:
4 Metal Layers: only METTHK allowed; MIMH are optional modules
6 Metal Layers: METMID or METTHK allowed; MIM or MIMH are optional modules
ProcessTape-inData ReleaseSamples Out
XS01807-Oct-1621-Oct-1606-Feb-17**
XS01806-Mar-1720-Mar-1624-Jul-17**
XS01804-Sep-1718-Sep-1722-Jan-18**
**This MPW run covers only a restricted set of modules. Only limited LVT & PPD option will be offered. Please check with your X-FAB contact prior to tape-in.
Top metal layers restriction for XS018 MPW runs:
4 Metal Layers: only METTHIN allowed; MIM23 or MIMH23 are optional modules
6 Metal Layers: only METMID allowed; MIM or MIMH are optional modules

X-CMOS 0.35 µm (*)

Process Tape-in Data ReleaseSamples Out
XH03519-Aug-1602-Sep-1628-Dec-16
XH03518-Nov-1602-Dec-1629-Mar-17
XH03520-Jan-1703-Feb-1702-Jun-17
XH03512-May-1726-May-1722-Sep-17
XH03518-Aug-1701-Sep-1729-Dec-17
XH03517-Nov-1701-Dec-1730-Mar-18
Additional runs available on request.
Usable modules: MOS, ISOMOS, THKOX, NMVMOS, PMVMOS, HVMOSMID, DEPL, BURDIF, CAPPOLY, HRPOLY, XRPOLY, TEEPROM, MIM, DMIM, METAL2, THKMET3, METAL4, THKMET, OTP, NHVETHK, PHVEMID, PHVETHK, NHVEMID
Process Tape-in Data ReleaseSamples Out
XU03504-Oct-1618-Oct-1619-Dec-16
Additional runs available on request.

X-CMOS 0.6 µm (*)

ProcessTape-inData ReleaseSamples Out
XC0624-Oct-1607-Nov-1608-Feb-17
XC0606-Jan-1720-Jan-1621-Apr-17
XC0616-Jun-1730-Jun-1729-Sep-17
XC0620-Oct-1703-Nov-1702-Feb-18

X-DIMOS 1.0 µm (*)

Process Tape-in Data ReleaseSamples Out
XDH10/XDM1005-Sep-1619-Sep-1621-Nov-16
XDH10/XDM1010-Mar-1724-Mar-1726-May-17
XDH10/XDM1008-Sep-1722-Sep-1724-Nov-17

* Notes:
Please make sure to submit your online SIFO, first GDS2 and PO by the Tape-in (Tape-out) deadline.
By the data release date, the DRC clean and released database plus all necessary documentation must be submitted in order to participate in the MPW shuttle.

The samples out date is based on the assumption that the most complex process variant is being used. By this date, dice in wafflepack can be delivered. For packaged samples, an additional 2-3 weeks are typically required.

All changes to above schedule will be automatically updated on this web page only.
In order to ensure that your device can be included in the MPW run, we encourage you to contact your local sales and support office or you send an email to: sifo(at)xfab.com