XFAB

06-07 Jun 2012: Sensors Expo & Conference, Rosemont, IL, USA

Wed, 06 Jun 2012 09:00:00 +0200

Sensors Expo & Conference is the only industry event in North America exclusively focused on sensors and sensor-integrated systems. The conference program is dedicated to exploring the most up-to-date innovations in sensor technology, including MEMS, Energy Harvesting, Wireless Sensor Data & Networks, Measurement & Detection, and more. Sensors Expo & Conference identifies cutting-edge trends, explores them in an information-packed conference program and reflects those trends throughout the exhibit floor with new product announcements, key technology-focused areas, such as Energy Harvesting, MEMS and Wireless, and a showcase of hundreds of products and services. For more information, visit www.sensorsexpo.com.

Meet us at booth #826.

To arrange for meetings with X-FAB at the show site, please contact Sales.Americas@xfab.com

30 & 31 May 2012: Webinar on Design Challenges & Solutions for AC LED Lighting and AC/DC Power Supply Applications

Wed, 16 May 2012 10:47:00 +0200

Stay tuned for more information on the upcoming webinar. The registration links and further information will be posted here shortly. If you would like to receive a personal invitation to the next webinar, please send an email to seminar@xfab.com

X-FAB Joins the IPL Alliance and Announces iPDK Availability

Mon, 14 May 2012 16:00:00 +0200

MOUNTAN VIEW, Calif. – The Interoperable PDK Libraries (IPL) Alliance announced today that X-FAB Silicon Foundries has joined the IPL Alliance, a standards organization whose charter is to establish an interoperable custom design ecosystem. X-FAB, the leading foundry group for analog/mixed-signal semiconductor applications, is making interoperable process design kits (iPDKs) available for its most popular foundry processes ranging from 0.6 to 0.13 micrometers.

The IPL Alliance, which includes major electronic design automation (EDA), semiconductor and foundry companies, released the industry’s first open standard for iPDKs for analog/mixed-signal designs in 2010. The iPDK standard is based on the OpenAccess database and uses standard languages and a unified architecture to enable interoperability among all EDA vendor tools. Engineering teams only need to develop a single PDK for each process node, which reduces development costs, shortens design cycles and provides designers with earlier access to advanced process technologies across multiple tools.

X-FAB is the leading analog/mixed-signal foundry group manufacturing silicon wafers for analog-digital integrated circuits (mixed-signal ICs). X-FAB maintains wafer production facilities in Erfurt and Dresden (Germany); Lubbock, Texas (US); and Kuching, Sarawak (Malaysia); and employs approximately 2,400 people worldwide. Wafers are manufactured based on advanced modular CMOS and BiCMOS processes with technologies ranging from 1.0 to 0.13 micrometers, for applications primarily in the automotive, communications, consumer and industrial sectors.

“We are committed to helping our customers make their analog/mixed-signal designs more robust and get to market faster," said Thomas Ramsch, director of design support at X-FAB. “Therefore, after extensive evaluation, we decided to join the IPL Alliance, adopt the iPDK standard and provide our customers with X-FAB iPDKs. We believe the standardization of PDKs can significantly lower the cost and reduce the effort for analog IP migration. By next month, X-FAB will be able to deliver iPDKs, for all supported EDA tools that work with the OpenAccess database, four times faster than before.”

“iPDKs are proven and provide semiconductor foundries significant benefits such as reducing PDK development and validation time, lowering support and distribution costs and enabling advanced design flows and multiple EDA tool support,” said Jingwen Yuan, president of the IPL Alliance and strategic alliance manager at Synopsys. “We are happy to add leading analog/mixed signal foundry X-FAB to our growing number of foundry members.”
About the IPL Alliance
The IPL Alliance is an industry standards organization established to develop an interoperable ecosystem for custom design by creating and promoting interoperable PDK standards. There are currently 30 semiconductor and EDA company members. For more information, please visit the IPL Alliance web site at http://www.IPLnow.com or contact info@iplnow.com

X-FAB が高温プロセスを 0.18 ミクロンまで拡張、高耐圧・高温・不揮発性メモリーの組み合わせが可能に

Tue, 20 Mar 2012 09:00:00 +0100

XH018 HT では、高性能のデバイスが多数追加され、

新しいアプリケーションへの応用が可能になります。

2012年3月20日（ドイツ、エルフルト）– 高温のアプリケーションに対するお客様の要望にお応えし、X-FABシリコンファウンダリー社は本日、XH018 HT高温モジュールオプションを発表しました。この新しいオプションは、XH018 プロセスに高温の機能を追加するものです。業界初で唯一の高温 (HT)、高耐圧 (HV)、そして、不揮発性メモリーを同時に利用できる 0.18 ミクロンプロセスとなります。この拡張では 13 の新デバイスが追加され、その中にはオン抵抗 (Ron) を改善した複数の高耐圧トランジスタ、対称型高耐圧トランジスタ、さらには、新しい静電 (ESD) 保護素子も含まれています。

この高温プロセスオプションは、自動車のエンジンルーム内の制御回路など、高温が要求される用途に最適です。自動車用途として最適な 45V までの動作電圧も持っております。このプロセスが持っている様々な機能を自由に組み合わせることにより、産業・医療・民生の幅広い電圧レンジにおいて、モーター制御・電力制御・電力変換などのアプリケーションで、新しい提案が可能となります。

XH018 HT 高温プロセスオプションでは、追加マスク無しで集積回路 (IC) の動作温度が 175℃までに拡張され、費用効果がとても高くなっています。追加デバイスの中には、10V・20V のトランジスタや、対称型の高耐圧トランジスタが含まれており、お客様のデザイン・製品開発にお使いいただけます。18V ショットキーダイオードは、チャージポンプ回路や、 ESD 保護素子としてもお使いいただけます。

X-FAB 最高技術責任者Jens Kosch は、今日のこの発表の重要性について以下のように述べています。「高温の動作条件では、デバイスの信頼性が問題となる場合が有りますが、XH018 HT の高温拡張では、このような極限の環境でも問題無く動作するような新しい製品を、新たなアプリケーションとして開発することが可能となります。強固なプロセス基本設計と、新たに追加された様々な特性評価やモデリングにより、寿命延長と劣化の減少が実現でき、デバイスは高温でも正しく動作します。さらに、不揮発性メモリーを集積化したいという要望もますます増えてきており、この拡張された動作条件下で我々のメモリー IP を利用するための手法も開発しました。我々の持っている埋め込み型の Flash・NVRAM・Trim OTP などは、お客様の製品開発における柔軟性・信頼性を高めるものです。」

広範囲なデザインサポート

X-FAB はこの新しい XH018 HT モジュールオプションに対して、充実したサポートを提供しています。最新のプロセスデザインキット (PDK) は、X-FAB のオンライン技術データベース (X-TIC) からダウンロード可能です。デバイスモデルも揃えられており、GSA スタンダードに則ったものとなっています。デザインキットには、Cadence 6.1 用の基本素子ライブラリーや、主要な SPICE シミュレーションツール用の正確な素子モデルも含まれています。ESD 保護やラッチアップに関するガイドラインも提供されています。X-FAB はまた X-TIC を通じて、安全動作領域 (Safe Operating Area, SOA) やデバイスの劣化に関する情報を含む信頼性スペックも提供しています。

利用可能時期について

XH018 HT 高温拡張は、お客様からのテープインに対する準備ができております。お客様はプロトタイプのデザインをスタートできます。埋め込み型 Flash・Trim OTP・NVRAM コンパイラーと高温 (175℃まで) の独特な組み合わせが可能になるのは、次の四半期からです。お客様は、すぐに利用できる X-FAB のメモリーブロックを使うか、お客様のメモリーデザインを使うかを選択できます。X-FAB の寿命計算ツールも次の四半期に利用可能となる予定です。

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X-FABについて

X-FABは、アナログ/ミックスドシグナル集積回路（ミックスドシグナルIC）向けのシリコンウエハを製造し、アナログ/ミックスドシグナルの分野で世界をリードするファウンダリーです。製造拠点はドイツのエルフルトおよびドレスデン、米テキサス州のラボック、マレーシアのサラワク州クチンにあり、約2400名の従業員が世界中で勤務しています。ウエハは1.0umから0.13umにわたる技術を備えた、モジュールオプション化CMOS及びBiCMOS先端プロセスで製造されており、そのアプリケーションは主に自動車・通信・民生・産業の各分野に広がっています。詳しい情報はwww.xfab.comをご覧ください。

X-FAB Uses Silicon Frontline’s Post-Layout Extraction Software to Enhance its Advanced Mixed-Signal Process Design Kit

Thu, 02 Feb 2012 14:30:00 +0100

Use of SFT’s R3D software for XH018 process design kit improves high-voltage and driver characteristics of mixed-signal SOC designs

Campbell, Calif.– February 2, 2012 – Silicon Frontline Technology, Inc. (SFT), an Electronic Design Automation (EDA) company in the post-layout verification market, announced today that X-FAB Silicon Foundries has used SFT’s R3D (Resistive 3D) software for X-FAB’s 0.18 micrometer high-voltage process (XH018), providing improvements in reliability and efficiency. X-FAB is the world's leading foundry group for More-than-Moore semiconductor applications.

X-FAB’s XH018 modular mixed-signal CMOS technology can be integrated with high-voltage (HV) and non-volatile memory (NVM) modules, making it ideal for SOC applications in the automotive market and embedded NVM applications in the communications, consumer and industrial markets. R3D is used for extraction and analysis of power devices. The combination of SFT’s R3D software and X-FAB’s 0.18 micrometer process supports advanced electronic designs targeting mixed-signal applications with HV and NVM modules.

“Our customers are seeking ways to design more reliable and efficient SOCs for their automotive, power management and NVM embedded applications,” stated Thomas Ramsch, Director Design Support at X-FAB. “After extensive evaluations, we decided to start using Silicon Frontline’s R3D software for our XH018 process. R3D enhances our customers’ SOC design quality and time to market with its powerful analysis and visualization of current density, potential distribution and IR drop. Therefore, we will offer XH018 Pcells for driver integration as part of our PDK by early March, giving customers a way to check their layout, optimize Rdson and do reliability checks.”

X-FAB manufactures wafers for automotive, industrial, consumer, medical, and other applications on modular CMOS and BiCMOS processes in geometries ranging from 1.0 to 0.13 micrometers, and offers special BCD, SOI and MEMS long-lifetime processes. It is recognized for solid, specialized expertise in advanced analog and mixed-signal process technologies, and maintains a high level of responsiveness, service and technical support for its customers.

“We are proud to add X-FAB to the list of the leading foundries that have qualified our 3D post-layout software for their advanced mixed-signal processes,” said Yuri Feinberg, SFT CEO. “We believe that our R3D’s analysis software is ideal for improving X-FAB’s customers’ design efficiency and reliability.”

About R3D
Silicon Frontline’s R3D combines 3D extraction with a new analysis engine to handle the accuracy and capacity requirements with a fast turnaround. To date, R3D has been adopted by more than 20 customers and applied to MOS, DMOS, LDMOS, vertical DMOS, waffle-style and GaN HEMT designs.

About Silicon Frontline
Silicon Frontline Technology, Inc. provides post-layout verification software that is Guaranteed Accurate and works with existing design flows from major EDA vendors. Using new 3D technology, the company’s software products improve silicon quality for standard and advanced nanometer processes. For more information please visit www.siliconfrontline.com. For sales or general assistance, please email info@SiliconFrontline.com.

All trademarks and tradenames are the property of their respective holders.

X-FAB Extends 0.18 Micrometer Technology Platform to Address Energy Efficiency Applications

Tue, 01 Nov 2011 09:00:00 +0100

New 60V capability in combination with eFlash enables new generation of power management applications for smart power control SoCs

X-FAB Silicon Foundries today announced the new technology platform XP018, its latest foundry process with the industry’s lowest mask count for the modular combination of digital, analog and high-voltage features with embedded Flash. This unique foundry offering for energy-efficient applications is the first to allow system-on-chip (SoC) integration requiring up to 60V operating voltage and 5V power supply to be combined with embedded non-volatile memory (NVM). It enables a new generation of reliable and efficient power management, digital control and other power control SoC applications.

The new XP018 process platform comes with operating voltages ranging from 5V to 60V, and an industry-competitive RDSon to enable small chip sizes and lower costs. Its unique combination of high voltage and embedded non-volatile memory requires fewer than 30 masks – the lowest mask count in the foundry industry for these features. The process is also well suited for automotive applications.

X-FAB’s CEO Rudi De Winter said, “The industry is very engaged in developing energy-efficient chips and systems. We developed the XP018 technology to address what our customers need – a cost-effective way to design smart systems-on-chip that combine the 60V capability with Flash-based embedded microcontrollers for the next generation of power management applications.”

The process topology comes with a wide range of NVM options including poly fuse, OTP, EEPROM and Flash, all of which will be available in 2012 for fully qualified PDK support.

Availability
The XP018 technology is available now for tape-ins, including pre-released IP for the memory options. Full qualification will follow in 2012.

CEITEC S.A. Announces Volume Production of the Chip do Boi Device

Tue, 18 Oct 2011 09:00:00 +0200

RFID Device becomes Brazils First Homegrown Chip to Reach Mass Manufacturing at X-FAB

PORTO ALEGRE, Brazil – October 18, 2011: CEITEC S.A., a Brazilian company that develops and produces application-specific integrated circuits (ASICs) today announced that it has reached volume production for the first semiconductor device designed in-house. The device announced is being manufactured at X-FAB Semiconductor Foundries in Germany. Today’s announcement marks a major milestone in the country’s effort to develop a domestic microelectronics industry.

CEITEC’s Chip do Boi is an advanced LF-RFID device designed for use in Brazil’s cattle industry as part of a leading-edge system to track livestock. Forecasted domestic demand for the chip is as high as 1.5 million units for 2012 with an expected minimum growth rate of 10 percent a year over the next decade. Chip do Boi is the first chip designed in Brazil by Brazilian engineers in a company that was homegrown and home funded to reach volume production at a world-class semiconductor manufacturing facility. CEITEC has been guiding the efforts to foster industry advances in electronics since 2008.

“Today’s volume manufacturing milestone means that chips designed in Brazil will soon hit the market, but more importantly, it signifies the country’s ability to produce world-class technology and lays the foundation for a growing, sustainable industry,” said Dr. Cylon Gonçalves da Silva, President of CEITEC. “This is an extraordinary achievement both scientifically and commercially and we are happy to have X-FAB Semiconductor Foundries as our manufacturing partner.”

X-FAB is one of the world's leading manufacturers for analog/mixed-signal semiconductor applications. The company has been chosen by CEITEC to produce the Chip do Boi design at its wafer fab in order to serve the market in Brazil and around the world, because X-FAB’s 0.6 micrometer CMOS technology is the same that will soon be available in CEITEC’s own manufacturing facility.

Thomas Hartung, VP Marketing at X-FAB remarked: “With the announcement of the Chip do Boi CEITEC has demonstrated its excellent capabilities to successfully launch products into the Brazilian market using a global supply chain. We are proud to be a long-term partner of CEITEC and to do business with a center for IC development and manufacturing in Brazil. We are looking forward to further intensify our relationship in the future in the field of know-how transfer as well as in manufacturing of high-performance mixed-signal ICs. X-FAB believes that this collaboration and the dynamic growth of the strong Brazilian economy will be the base of our mutual success.”

CEITEC licensed X-FAB’s advanced 0.6 micrometer process technology called XC06, enabling CEITEC to establish the first commercial CMOS semiconductor front-end manufacturing operation in Brazil. On the other hand, X-FAB is able to increase its presence in the emerging and fast-growing Latin American electronics market, with other technology nodes.

Chip do Boi is only the first RFID chip designed by CEITEC SA to go into volume production. The company has announced that two more RFID chips are undergoing performance tests and will go into volume production in 2012.

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About CEITEC
CEITEC S.A. is a Brazilian company focused on the development and production of application-specific standard products (ASSPs) for the RFID, wireless communications and digital multimedia markets. The company’s design center, located in Porto Alegre, develops chips that will play a strategic role in Brazil’s microelectronics industry. The company’s adjoining foundry, now in the final stages of assembly and certification, is the first and only facility of its kind in Latin America that is capable of producing advanced types of ICs in commercial scale. CEITEC S.A.'s mission is to position Brazil as a global player in advanced microelectronics.

X-FAB and Senodia Bring MEMS Gyroscopes to China

Thu, 13 Oct 2011 09:00:00 +0200

Senodia selects X-FAB as MEMS foundry for high-volume production of single- and 3-axis gyroscopes ERFURT, Germany and Shanghai, China; October 13, 2011 – X-FAB Silicon Foundries Group and Senodia Technologies (Shanghai) Co., Ltd today announced they have concluded development and are ramping production of microelectromechanical system (MEMS) gyroscopes for high-volume consumer applications. X-FAB will serve as the front-end manufacturing partner, leveraging its open-platform inertial sensor process. Senodia will use sensor devices manufactured by X-FAB to produce single-axis and 3-axis gyroscopes. X-FAB, a leading pure-play MEMS foundry, offers a range of qualified open-platform MEMS process technologies covered by comprehensive design support. Senodia is the first commercial MEMS supplier to design and package gyroscopes in China. It recently raised its production capacity to more than 2.5 million MEMS gyroscope chips per month.

Single-axis MEMS gyroscopes can detect movement on one axis of rotation – yaw, pitch or roll – and more complex 3-axis gyroscopes can detect movement in all three. These gyroscopes are ideal for many high-volume applications such as mobile phones, tablet PCs, camcorders, gaming controllers, remote controls, digital cameras, electronic toys, and automotive and medical devices.

Bo Zou, Chairman/CEO of Senodia said, “We chose to work with X-FAB because of its high-performance process technology that enables us to develop products very rapidly and cost-effectively for the market place. X-FAB’s open platform inertial sensor process was immediately available and ready to use for realizing our designs. With X-FAB’s experience as a high-volume MEMS foundry, and our expertise and commitment to help customers develop their MEMS gyroscope applications, we believe Senodia is at the forefront of serving the world’s ever-increasing market demand for MEMS gyroscopes in consumer electronics.”

X-FAB has provided a MEMS foundry service for more than 10 years and considers inertial MEMS a cornerstone for the company’s MEMS growth. X-FAB CEO Rudi De Winter said, “Our goal is to provide fast and easy foundry access for our customers to develop and manufacture first-time-right products. We are very pleased to work with Senodia, which has turned the inertial MEMS technology platform in record time into a gyro product that meets market needs.”

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About Senodia
Senodia Technologies (Shanghai) Co., Ltd is the first commercial MEMS Gyroscope sensor supplier in China, founded in August, 2008. Its headquarters is in ZhangJinag Hi-Tech Park Shanghai, China. Senodia has the leading-edge MEMS process and integration technology with its own intellectual property (IP). Senodia focuses on designing and manufacturing low-cost, low-power, high performance/price ratio and small-sized MEMS Gyroscope chip for the consumer electronics and automotive markets. Senodia is also committed to provide customers with total solutions and best services.

About X-FAB
X-FAB is the leading analog/mixed-signal foundry group manufacturing silicon wafers for analog-digital integrated circuits (mixed-signal ICs). X-FAB maintains wafer production facilities in Erfurt and Dresden (Germany); Lubbock, Texas (US); and Kuching, Sarawak (Malaysia); and employs approximately 2,400 people worldwide. Wafers are manufactured based on advanced modular CMOS and BiCMOS processes with technologies ranging from 1.0 to 0.13 micrometers, for applications primarily in the automotive, communications, consumer and industrial sectors. For more information, please visit www.xfab.com.

X-FAB Qualifies Cadence Physical Verification System for All Process Nodes

Wed, 05 Oct 2011 09:00:00 +0200

Customers of Leading Mixed-Signal Foundry Group Reap Benefits of In-Design Physical Verification Integrated with Cadence Encounter and Virtuoso Technologies SAN JOSE, Calif., Oct. 5, 2011—Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that X-FAB, a leading foundry group for analog/mixed-signal semiconductor applications, has qualified the Cadence® Physical Verification System for the majority of its process technologies. Foundry qualification means that X-FAB has given its stamp of approval for silicon accuracy of the Cadence Physical Verification System across all of its process nodes, and that mixed-signal customers can reap new performance and productivity advantages enabled by its tight integration into the Cadence Virtuoso® and Encounter® flows.

“Creating an advanced mixed-signal SoC presents significant challenges,” said Dr. Jens Kosch, chief technology officer at X-FAB. “Our customers welcome any opportunity to streamline the development process, so we were pleased to qualify and endorse the Cadence Physical Verification System for our process technologies at X-FAB.”

The Cadence Physical Verification System delivers in-design and final signoff design rule checking (DRC) and layout versus schematic (LVS) verification at transistor, cell, block, and full-chip/SoC levels. It integrates with industry-standard end-to-end digital and custom/analog flows, enabling more efficient Silicon Realization methodologies.

“Design teams prefer to stay within the same environment for design, implementation, and verification to shorten turnaround time and ensure design quality. This qualification means X-FAB customers can confidently conduct all required physical verification using the Cadence Physical Verification System, remaining in the design and implementation cockpit to improve productivity,” said John Murphy, group director, alliances marketing at Cadence. “We worked closely with X-FAB to address all its stringent verification qualification requirements, meeting and exceeding all sign-off parameters. This type of deep collaboration with leading foundries is an essential element of the EDA360 vision.”

By tightly integrating design rule checking into the Cadence implementation technologies, design teams will be able to validate against signoff DRC validation as they edit, allowing them to find and fix errors earlier in their flow while saving them time in longer loops through standalone signoff solutions. The result is faster time to tapeout. Cadence and X-FAB continue to work closely together to provide validated signoff verification decks for their mixed-signal customers.

About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.

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^{Cadence, Virtuoso, Encounter and the Cadence logo are registered trademarks of Cadence Design Systems, Inc. in the United States and other countries. All other trademarks are the property of their respective owners.}

X-FAB がパワーマネージメント向けに高温プロセスを拡張

Thu, 08 Sep 2011 09:10:00 +0200

2011年9月8日（ドイツ、エルフルト）– X-FABシリコンファウンダリー社は本日、お客様の要望に応え、0.35um高温プロセスのXA035に新たに28の素子を追加した拡張プロセスを発表しました。このプロセスは、業界初の動作電圧100Vと動作温度175℃を同時に実現できるものとなっており、この組み合わせにより、厳しい環境における高効率のパワーマネージメントを必要とする新世代集積回路 (IC) の設計・製造が可能となります。ハイブリッドや電気自動車のバッテリーなど、チャージバランスを必要とする用途向けとしては理想的であり、さらに、温度範囲が拡張されたため、燃焼室やエンジンハウジングの中の制御デバイスにも適用可能となります。この新しい技術は、産業・医療・民生においても、幅広い電圧範囲が必要なパワーマネージメント・電力変換に適しています。

XA035プロセスの全てのデバイスは、Automotive Electronics Council (AEC) AEC-Q100の品質基準に準拠しています。また、新しいN型・P型DMOSでは、オン抵抗が45%小さくなっているため、システムコスト削減にも貢献します。XA035プロセスのデザインキットは、主要なEDAプラットフォームに対応しており、高耐圧トランジスタの正確なモデルも含まれています。面積・スピード・ローパワー・ローノイズのそれぞれに最適化された高密度標準セルライブラリーも用意されており、デザインサポートとしてさらに、ESD 保護素子を含むI/Oライブラリーも提供されます。

X-FAB アナログ・高耐圧ビジネスラインマネージャー Sebastian Schmidt は、次のようなコメントを寄せています。「我々のお客様は、チャージバランスやその他の自動車向けデバイスに必要となる極度の高温・高耐圧を実現できるファウンダリープロセスを望んでいます。これらの用途では、ゆるぎない高信頼性・長寿命が非常に重要となり、弊社はそれらを実現できるファウンダリーです。」

今回の拡張プロセスでは、13の低オン抵抗高耐圧デバイスとバイポーラ素子を含む28の新しい素子が追加され、さらに、新しいワンタイムプログラミング (OTP) 素子も利用可能となります。5V ゲート酸化膜オプションにより、5V・45V・70V・100Vの動作電圧範囲もカバーでき、パワーマネージメントや自動車用途向けに適しています。全ての素子は正確にモデリングされており、モデルガイドにその内容が詳細に記述されています。信頼性・寿命計算ツールも合わせて提供され、温度と動作条件のプロファイルを与えると、寿命と温度のトレードオフを見積もることが可能です。また、増え続けるESDに関する要求に応えるため、XA035プロセスには、ESD保護素子を含む新しいライブラリーが追加されています。

利用可能時期について

新しい素子やオプションを含む高温アプリケーション向けXA035プロセスは、お客様からのテープインの準備ができています。

X-FABについて

X-FABは、アナログ/ミックスドシグナル集積回路（ミックスドシグナルIC）向けのシリコンウエハを製造し、アナログ/ミックスドシグナルの分野で世界をリードするファウンダリーです。製造拠点はドイツのエルフルトおよびドレスデン、米テキサス州のラボック、マレーシアのサラワク州クチンにあり、約2400名の従業員が世界中で勤務しています。ウエハは1.0umから0.13umにわたる技術を備えた、モジュール化されたCMOS及びBiCMOS先端プロセスで製造されており、そのアプリケーションは主に自動車・通信・民生・産業の各分野に広がっています。詳しい情報はwww.xfab.comをご覧ください。