X-FAB platform technology XM-SP for absolute pressure sensors.

Main process features:

Silicon bulk substrate
Silicon wafer bonding
Membrane fabrication by wafer thinning and polishing
Sealed cavity for vacuum reference
Implanted piezoresistors
Fully characterized sensor IP blocks available for pressure ranges up to 3 bar, 6 bar and 15 bar (see infosheet)
customer specific pressure sensors available on request
integrated version: available as MEMS module for integration with X-FAB CMOS technology XC10 (see infosheet)