X-FAB's Open Platform Technologies

As a pure-play foundry specialized in mixed-signal applications, X-FAB offers a wide range of open platform process technologies that combine advanced modular CMOS and BiCMOS platforms with a broad spectrum of additional analog functions and modular options.

CMOS Technologies

0.18 µm - 1.0 µm modular mixed-signal CMOS technologies

BiCMOS Technologies

0.6 µm technology

SOI-CMOS Technologies

0.18 µm, 0.6 µm & 1.0 µm CMOS and BCD technology on SOI substrates

MEMS Technologies

Microelectromechanical sensor technologies combined with CMOS

Customer specific process
development

Proven competence for installing MOS and MEMS technologies