X-FAB Technology
As a pure-play foundry specialized in mixed-signal applications, X-FAB offers a wide range of process technologies that combine advanced modular CMOS and BiCMOS platforms with a broad spectrum of additional analog functions and modular options.
CMOS Technologies | 1.0 - 0.18 µm modular mixed-signal CMOS technologies |
BiCMOS Technologies | 0.6 µm technology |
SOI-CMOS Technologies | 0.6 µm & 1.0 µm CMOS and BCD technology on SOI substrates |
MEMS Technologies | Microelectromechanical sensor technologies combined with CMOS |
CUSP | Proven competence for installing MOS and MEMS technologies |
