23 entries, filtered by: Wafer Manufacturing
Published: December 2012

The fabrication of semiconductor devices, even in the area of customer oriented business, is one of the most complex production tasks in the world. A typical wafer production process consists of several hundred steps with numerous resources like equipments and operating staff. The optimal assignment of each resource at each time for a certain number of wafers is vital for a efficient production process. Several demands defined by the customers and facility management must be taken into consideration with the objective to find the best tradeoff between the different needs.


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Published: October 2012

Hermetic sealing is important regarding functionality and reliability for MEMS components. Typically this sealing is done on the wafer level using wafer bonding which simultaneously also provides mechanical protective caps. However, inner pressure and hermeticity testing and monitoring a still a critical issue; therefore, in this paper a test structure adapted to a MEMS foundry process for inertial sensors is introduced.


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Published: October 2012

State of the art polymer strippers were identified and successfully evaluated as interesting alternatives as CMOS-compatible wet activations for semiconductor wafer direct bonding processes, including both high and low temperature annealing for bond interface strengthening. The polymer strippers achieve both excellent surface cleaning and wafer bonding activation by hydrophilization and are therefore a very interesting alternative as semiconductor direct wafer bonding pre-treatment.


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Published: April 2012

Inline defect control systems are used across the semiconductor industry for detection of process failures like equipment issues or yield problems. Besides to the goal to improve the yield of each process, it may have a negative influence on factory performance as well. The measurement of all lots in all defect control monitors of a process is not feasible, even when there are bottleneck situations.


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Published: April 2012

In a typical ASIC semiconductor facility, there are hundreds of products processed on dozens of different equipments with unequal characteristics. Sequence depended equipment setups, failures, preventive maintenance and product specific re-entrant flows cause a high variability in factory performance measures. Also different customer demands, which are natural in the foundry business, should be taken into account (e.g. delivery dates or throughput). To reduce the variability and to improve the factory performance a robust and efficient dispatching and scheduling strategy is vital.


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Published: December 2011

Looking for new improvement options such as new dispatching rules of an existing semiconductor fabrication facility, a detailed model is indispensable to check the data quality as well as detecting main influences of the facility and finally testing the new optimization approaches. In this paper, the whole way is described starting from the data acquisition and finishing with a appropriate model. In this study the modeling tool AnyLogic 6 is used. The model generation process show how important a reliable factory database is and shows first appendages of automated model generation. An other important fact presented is the verification of the model according to real factory performance indicators.


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Published: December 2011

Based on specific technology flows, various surface layers are bonded by glass frit wafer bonding. In this paper, the behaviour of typical layers, such as TEOS, Nitride and thermal oxide, and their effect on the bonding results are introduced.


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Published: September 2007

Using silicon-based MEMS technologies, the cost-efficient production of gyroscopes has become possible in recent years. As a result, gyroscopes are entering new markets, such as for highly accurate GPS-Instruments where the gyroscope enhances accuracy in situations where satellite reception is lost, for example in tunnels. However, since all gyroscopes are very precise resonating measurement devices, this leads to stringent wafer processing requirements for their production.


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Published: May 2004

This paper reports on glass frit wafer bonding, which is a universally usable technology for wafer level encapsulation and packaging. After explaining the principle and the process flow of glass frit bonding, experimental results are shown. Glass frit bonding technology enables bonding of surface materials commonly used in MEMS technology. It allows hermetic sealing and a high process yield. Metal lead throughs at the bond interface are possible, because of the planarizing glass interlayer. Examples of surface micromachined sensors demonstrate the potential of glass–frit bonding.


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Published: October 2003

The importance of surface micromachining processes has increased over the last few years. After the fundamental problems of these technologies have been solved in research institutes, surface micromachined components now arrive in industrial production, e.g. inertial sensors for automotive applications. In comparison to the classical bulk micromachined components, technologies based on surface micromachining provide a wide range of advantages.


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