104 entries, filtered by: Paper
Published: April 2012

Inline defect control systems are used across the semiconductor industry for detection of process failures like equipment issues or yield problems. Besides to the goal to improve the yield of each process, it may have a negative influence on factory performance as well. The measurement of all lots in all defect control monitors of a process is not feasible, even when there are bottleneck situations.


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Published: March 2012

X-FAB, a pure play foundry, has already extensive experience in volume production of monolithic integrated MEMS devices. The idea of combining CMOS and MEMS processes to obtain monolithic integrated sensor solutions is a logical, consequent step following the “More than Moore” strategy.


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Published: February 2012

PIN photodiodes are often used in optical integrated circuits. Although they can feature a very good RF-performance, this can be effected by the optical power density of the incident light. The influence of this effect on the RF-performance of PIN photodiodes is described. When a critical optical power density in the epi-layer is exceeded the 3dB frequencies are cut off. An analytical equation is derived to describe the effect. The results are compared to RF measurements and verified by numerical simulation.


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Published: February 2012

Moore’s law has been a strong influence on mainstream microelectronics over the past few decades, where the trends of decreasing feature size and increasing transistor count have driven the semiconductor industry forward. This philosophy has worked very well for memories and microprocessors in the digital world. Additional analog functions, by interfacing with the physical world, enable cost-optimized and value-added system solutions.


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Published: December 2011

Based on specific technology flows, various surface layers are bonded by glass frit wafer bonding. In this paper, the behaviour of typical layers, such as TEOS, Nitride and thermal oxide, and their effect on the bonding results are introduced.


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Published: December 2011

Looking for new improvement options such as new dispatching rules of an existing semiconductor fabrication facility, a detailed model is indispensable to check the data quality as well as detecting main influences of the facility and finally testing the new optimization approaches. In this paper, the whole way is described starting from the data acquisition and finishing with a appropriate model. In this study the modeling tool AnyLogic 6 is used. The model generation process show how important a reliable factory database is and shows first appendages of automated model generation. An other important fact presented is the verification of the model according to real factory performance indicators.


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Published: November 2011

The purpose of this paper is to study the order management flow currently implemented in supply chain of a semiconductor industry. There are various activities involved in a supply chain ranging from providing raw materials to the production of products, and also to ensure the delivery of the end products to customers. The main focus of a supply chain is to ensure that customers' orders are well-managed from the first day when the order is placed until the last day when the end products are ready to be delivered to customers. In other words, order fulfillment process (OFP) has to be practiced every time when customers place order.


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Published: November 2011

The power semiconductor industry has grown steadily in past two decades from $2.7 billion in 1992 and is expected to reach $13.1 billion in annual sales volume this year due to rapid proliferation of power electronics in many fields like telecommunication, automotive, new renewable energy system and energy conversion application. Among power transistor products, sales of modules built with Insulated Gate Bipolar Transistor (IGBT) are expected to increase 10 percent to $2.5 billion this year.
This paper gives an overview to different types of IGBTs available in current market as well as those under development.


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Published: September 2011

For the Synchronous DC-DC converter switching performance of low-voltage power MOSFETs, the gate-drain charge density (Qgd) is an important parameter. The so-called figure-of-merit, which is defined as the product of the specific on-resistance (Ron.sp) and Qgd is commonly used to quantify the switching performance for a specified off-state breakdown voltage (BVds).


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Published: September 2011

Wire Bond Shear (WBS) test is a method for evaluating the strength of a ball bond, to complement wire pull test. In foundry, wafer-level (WLR) WBS provides a quick way to demonstrate the integrity of metal bond pad, backend scheme as well as bond or via design. This is a big challenge for WLR WBS outsourcing as many of the factors affecting shear strength lying on the wire bonding parameters and shear test setup. This paper presents the outsourcing experiences of WBS tests and good shear strength was achieved from the outsource laboratory.


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