22 entries, filtered by: Webinar Recording
Published: October 2013

Is there magic that makes analog designs successful? How can designs achieve ESD (electro-static discharge) specifications? Do DFM methods make designs more robust? This webinar answers these questions and provides tips & tricks for analog design.


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Published: October 2013

This webinar session provides guidance through the EDA environment and describes the interaction among EDA tools, design methodology and PDKs to optimize the design process. It uses selected reference flows and best practice examples for critical components during the design phase.


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Published: September 2013

This webinar session focuses on the importance of proper characterization data for successful analog design, and discusses how modeling and process characterization can make life easier for analog design engineers. It covers statistic modeling approaches, model quality assurance and process calibration.


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Published: September 2013

Showing first-time-right performance statistics from X-FAB's customer base, this first session outlines the challenges involved in achieving first-time-right analog designs. It talks about what impact the choice of process architecture makes, and discusses the pros and cons of different process architectures including SOI and BCD.


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Published: May 2013

What happens when optical signals are converted to electrical signals? Focusing on the optical to electrical conversion process, this webinar sheds some light on the basics of light interaction from reflection, transmission, polarization and refraction to absorption with semiconductors devices. It explores electrical fields, recombination and lifetime, doping profiles, band structures and pn-junctions to determine what happens when light has been converted into electron-hole pairs. This webinar provides a solid overview of passive and active optical sensor elements manufactured in a mixed-signal CMOS process or added during post processing


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Published: March 2013

Everyone agrees that developing an IC is a challenging process with multiple trade-offs. You have to balance performance, size and cost requirements to decide how best to integrate customized memories. It’s fairly straightforward for ROM and RAM volatile memories because of well-established compiler solutions. But non-volatile memories (NVM) for trimming, data storage and programming require special consideration. X-FAB makes customizing complex embedded NVM solutions (such as EEPROM, OTP and NVSRAM) fast, easy and with minimal risks for errors. This webinar includes a live demo of an NVM compiler for NVRAM often used for data storage. You’ll see how easy and fast it is to customize your memory block design using the front-end design data (black box layout, a simulation model, a datasheet and a test specification) you receive from X-FAB within minutes via e-mail.


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Published: November 2012

Are you challenged with having to design a device that requires bidirectional isolation and has several voltage levels integrated on a single chip without latch-up? If that is the case, you should join our upcoming webinar introducing XT018, the world’s first trench-isolated SOI (silicon on insulator) foundry technology offering for 200V MOS capability at 180nm. The presentation covers the general benefits and trade-offs of using SOI technology vs. a silicon bulk process. It highlights features such as super-junction architecture for 100V to 200V devices with complete dielectric isolation, the possibility to apply defined handle wafer potentials, and a highly flexible modular approach for selecting specific technology features that meet your exact needs.


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Published: September 2012

Ever been stuck with the “one product, one process” rule when what you really needed was access to a world-class quality process for multiple applications? Not anymore.
X-FAB is presenting a webinar on its open-platform MEMS inertial sensor processes including its new 3D inertial sensor technology. Learn how you can use X-FAB’s design partner, MicroMountains Applications, or apply your own design to X-FAB’s ready-to-use processes to run high or low wafer volumes without long and costly process development. Find out how X-FAB can help you get to market faster and secure high-quality manufacturing for inertial sensors. You’ll get an overview of both inertial sensor technologies and IP blocks from X-FAB, as well as design and test support from MicroMountains Applications.


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Published: June 2012

Sensors are everywhere, serving as an interface between our analog world and the digital world of data processing in electronic systems. Is your design challenge – making sensor output signals available to complex digital systems – further complicated by the need for low noise, temperature-dependent behavior and non-linear effects? If you are looking for solutions for low noise amplification and temperature drift, non-linearity or signal offset compensation, don’t miss this free webinar. It helps designers select the right technology for low-noise and high-precision sensor interfaces. You’ll get tips for achieving excellent matching for robust circuits, and see how X-FAB’s sophisticated modelling enables first-time-right analog and mixed-signal designs.


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Published: May 2012

Overwhelmed by the complexity of 700V designs due to cross talk, ESD, reliability or latch-up issues? Are your design challenges compounded by chip size and time-to-market issues? This webinar showcases X-FAB's new CMOS-based process for ultra-high-voltage apps such as AC LED lighting, ultra-low standby/no-load power and other power conversion and control applications. The combination of this cost-competitive process architecture and X-FAB’s design support enables first-time-right/first time functional designs for high-voltage lighting and power supply applications


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