21 entries, filtered by: MEMS
Published: September 2002

Wafer bonding is an basic process in nearly all technologies for industrial MEMS production. To the one wafer bonding is used to pre-process substrates with buried layers, to make special micromachining processes possible. On the other hand wafer bonding is necessary for zero level packaging, the encapsulation and sealing of free moveable structures and cavities on wafer level. The wafer bonding steps of industrial used technologies have to be very reproducible and safer to ensure an economical use by sufficient high yield.


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