152 entries
Published: April 2012

The article at hand presents the results of thermoelectrical simulations of migration effects in integrated interconnect systems in comparison to measurement data. The simulation concept will be described and the output values as mass flux divergence and time-to-failure (TTF) will be discussed.


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Published: April 2012

In a typical ASIC semiconductor facility, there are hundreds of products processed on dozens of different equipments with unequal characteristics. Sequence depended equipment setups, failures, preventive maintenance and product specific re-entrant flows cause a high variability in factory performance measures. Also different customer demands, which are natural in the foundry business, should be taken into account (e.g. delivery dates or throughput). To reduce the variability and to improve the factory performance a robust and efficient dispatching and scheduling strategy is vital.


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Published: April 2012

Inline defect control systems are used across the semiconductor industry for detection of process failures like equipment issues or yield problems. Besides to the goal to improve the yield of each process, it may have a negative influence on factory performance as well. The measurement of all lots in all defect control monitors of a process is not feasible, even when there are bottleneck situations.


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Published: March 2012

Electrostatic discharge (ESD) is a serious threat to integrated circuits (ICs) that can cause irreversible damage. This webinar on ESD protection will show you solutions on how to eliminate ESD threats in complex analog/mixed-signal and high-voltage designs. It covers an overview of various ESD protection concepts, and explains the structures and schemes available to protect against electrostatic discharge in X-FAB’s enhanced 0.35 and 0.18 micrometer XH035 and XH018 high-voltage foundry processes. The webinar presentation also highlights similarities and differences among ESD protection concepts, outlining the advantages and disadvantages of each in circuit designs.


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Published: March 2012

X-FAB, a pure play foundry, has already extensive experience in volume production of monolithic integrated MEMS devices. The idea of combining CMOS and MEMS processes to obtain monolithic integrated sensor solutions is a logical, consequent step following the “More than Moore” strategy.


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Published: February 2012

PIN photodiodes are often used in optical integrated circuits. Although they can feature a very good RF-performance, this can be effected by the optical power density of the incident light. The influence of this effect on the RF-performance of PIN photodiodes is described. When a critical optical power density in the epi-layer is exceeded the 3dB frequencies are cut off. An analytical equation is derived to describe the effect. The results are compared to RF measurements and verified by numerical simulation.


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Published: February 2012

Moore’s law has been a strong influence on mainstream microelectronics over the past few decades, where the trends of decreasing feature size and increasing transistor count have driven the semiconductor industry forward. This philosophy has worked very well for memories and microprocessors in the digital world. Additional analog functions, by interfacing with the physical world, enable cost-optimized and value-added system solutions.


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Published: December 2011

Based on specific technology flows, various surface layers are bonded by glass frit wafer bonding. In this paper, the behaviour of typical layers, such as TEOS, Nitride and thermal oxide, and their effect on the bonding results are introduced.


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Published: December 2011

Looking for new improvement options such as new dispatching rules of an existing semiconductor fabrication facility, a detailed model is indispensable to check the data quality as well as detecting main influences of the facility and finally testing the new optimization approaches. In this paper, the whole way is described starting from the data acquisition and finishing with a appropriate model. In this study the modeling tool AnyLogic 6 is used. The model generation process show how important a reliable factory database is and shows first appendages of automated model generation. An other important fact presented is the verification of the model according to real factory performance indicators.


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Published: December 2011

In this webinar you will learn how X-FAB can support & manufacture your power system-on-chips (SoC) with its latest 0.18 micrometer technology (XP018). This foundry process for power management applications comes with a unique combination of high-voltage and high-density non-volatile memory (NVM) options with the lowest mask count in the industry. Find out why it is well-suited for cost optimized migration of existing solutions in larger geometries to 180 nanometers. You will also learn about the various memory options and its competitive RDSon for switching and power control in the 15V, 25V, 40V, 60V range.


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