Home As the leading foundry group for analog/mixed-signal semiconductor applications, X-FAB offers modular CMOS and BiCMOS processes in geometries ranging from 1.0 to 0.18 µm, and special BCD, SOI and MEMS long-lifetime processes.
Main About X-FAB As the largest specialty foundry group, X-FAB is unlike typical foundry services because of its specialized expertise in advanced analog and mixed-signal process technologies.
Corporate Overview As the world's leading analog/mixed-signal foundry group, X-FAB creates a clear alternative to typical foundry services with solid, specialized expertise in advanced analog and mixed-signal process technologies. 
Key Facts X-FAB offers 1.0 to 0.13 µm mixed-signal, CMOS and BiCMOS and special BCD, SOI and MEMS long lifetime processes for automotive, industrial and medical applications.
Technology X-FAB offers a wide range of process technologies that include advanced modular CMOS and BiCMOS platforms with a broad spectrum of additional analog functions and modular options.Technology Overview X-FAB’s CMOS and BiCMOS platforms can be complemented with specialties ranging from analog mixed-signal functions to high voltage options, embedded non-volatile memories, optical, RF and bipolar elements, or the implementation of microelectromechanical sensor technologies. FeatureXplorer Find out what features and modules are available at each process node and how they can support your analog/mixed-signal design needs. CMOS X-FAB’s CMOS and BiCMOS platforms can be complemented with specialties ranging from analog mixed-signal functions to high voltage options, embedded non-volatile memories, optical, RF and bipolar elements, or the implementation of microelectromechanical sensor technologies.
BiCMOS X-FAB’s CMOS and BiCMOS platforms can be complemented with specialties ranging from analog mixed-signal functions to high voltage options, embedded non-volatile memories, optical, RF and bipolar elements, or the implementation of microelectromechanical sensor technologies.
SOI X-FAB offers a dielectric trench insulated smart power technology. The modular process combines DMOS, bipolar and CMOS processing steps that are compatible with dielectric insulation.
MEMS X-FAB has developed its own technology platforms for mainstream MEMS applications such as pressure sensors, inertial sensors and infrared sensors. These can easily be adapted to meet customer requirements.
CUSP Besides using X-FAB's proprietary technologies, you also have the opportunity to utilize our competence and manufacturing capacity for transferring your own processes to X-FAB for wafer foundry service. Feature Technologies By designing specific, modular processes tailor-made for a wide range of applications, X-FAB creates the perfect interface between the digital and the analog world for each of your target applications.
Service X-FAB technology platforms allows modular combinations of high-voltage, digital, analog and memory (NVM) options, with the possibility to add optical, RF and bipolar elements, as well as integrated sensors.Service Offering X-FAB strives to achieve full customer satisfaction by pursuing a holistic approach that combines specialized expertise with outstanding service and first-class technical support. It includes design support, prototyping and manufacturing support. Design Support As a company dedicated to offering its customers first-class service and support, X-FAB boasts the most comprehensive design support in the whole foundry business including a 24-hour technical hotline service.EDA Tool Support X-FAB maintains an intense and close collaboration with all major electronic design automation (EDA) suppliers to jointly develop design kits with them. This allows us to perfectly adapt to our customers' various design needs. Hotline Service The X-FAB hotline team is your interface to our mixed-signal design and process experts. Whether you have a question concerning design kits, libraries, IPs, process specifications, or safe operating areas, they will attend to it within the day. Process Modularity X-FAB has established a sophisticated modular technology approach to support analog mixed-signal applications. The whole modular system is based on just a few building blocks. The customer thus benefits from the huge flexibility, while manufacturing remains consistently robust. Analog IP X-FAB offers a broad spectrum of analog IP that can be tailored to your specific requirements: X-FAB provides the full design database, e.g. for band gaps, ADCs, or DACs, as a starting point for your own modifications. ESD Support X-FAB has designed new digital standard I/O libraries for 0.6 µm, 0.35 µm and 1.0 µm XD10 with ESD protection in mind. Digital IP X-FAB provides its customers with a wide range of free digital IP, including unique libraries tailor-made for various applications such as low power, low noise etc. This X-FAB specific IP is complemented by third party libraries.
Prototyping Support X-FAB offers two prototyping options for all supported technologies, the MPW (Multi-Product-Wafer) service or the MLM (Multi-Level-Mask) service.
Manufacturing Support X-FAB offers a range of e-Business services through its online platform X-CES (X-FAB Customer e-Business Services).
