Open Platform Technology XM-SC for Inertial Sensors

Main process features:

  • SOI substrate
  • Deep Reactive Ion Etching (DRIE)
  • Isotropic Silicon Etching
  • HF Vapour Etching
  • Wafer level packaging using glass frit bond

For more information, please download info sheet here.



Open Platform technology XMB10 for 3-Axis Inertial Sensors

Main process features:

  • Triple axis inertial sensor using cavity SOI wafer based technology
  • Sensor elements formed by silicon DRIE process
  • Optional top and bottom metal layers
  • Top cap wafer: Silicon with etched cavities and bond pad openings
  • Cost effective wafer level packaging by wafer bonding


For more information, please download info sheet here.