Open Platform Technology XM-SP for Absolute Pressure Sensors

Main process features:

  • Silicon bulk substrate
  • Silicon wafer bonding
  • Membrane fabrication by wafer thinning and polishing
  • Sealed cavity for vacuum reference
  • Implanted piezoresistors
  • Fully characterized sensor IP blocks available for pressure ranges up to 3 bar, 6 bar and 15 bar (see infosheet)
  • customer specific pressure sensors available on request
  • integrated version: available as MEMS module for integration with X-FAB CMOS technology XC10 (see info sheet)