Multi Project Wafer Schedule 2009
The timescales indicated below include the preparation of data from the different submissions,
fabrication with the maximum amount of process options, and individual dicing. To find out the
timescales of standard engineering lots please contact your local sales and support office.
X-CMOS 0.18 µm (*)
Process | Tape In | Samples Out |
|---|---|---|
XH018 | 09-Jan-09 | 13-May-09 |
XH018 | 20-Mar-09 | 22-Jul-09 |
XH018 | 05-Jun-09 | 07-Oct-09 |
XH018 | 21-Aug-09 | 20-Dec-09 |
XH018 | 13-Nov-09 | 17-Mar-10 |
X-CMOS 0.18 µm (*)
Process | Tape In | Samples Out |
|---|---|---|
XC018 | 19-Dec-08 | 16-Apr-09 |
XC018 | 06-Feb-09 | 05-Jun-09 |
XC018 | 22-May-09 | 18-Sep-09 |
XC018 | 11-Sep-09 | 08-Jan-10 |
XC018 | 04-Dec-09 | 02-Apr-10 |
X-CMOS 0.25 µm (*)
Process | Tape In | Samples Out |
|---|---|---|
0.25µm FC | 05-Nov-08 | 02-Feb-09 |
0.25µm FC | On request in 2009 | |
X-CMOS 0.35 µm (*)
Process | Tape In | Samples Out |
|---|---|---|
XH035 | 20-Feb-09 | 19-Jun-09 |
XH035 | 08-May-09 | 04-Sep-09 |
XH035 | 25-Sep-09 | 22-Jan-10 |
XH035 | 27-Nov-09 | 26-Mar-10 |
X-CMOS 0.6 µm (*)
Process | Tape In | Samples Out |
|---|---|---|
XC06 | 21-Nov-08 | 19-Mar-09 |
XC06 | 09-Jan-09 | 07-May-09 |
XC06 | 03-Apr-09 | 30-Jul-09 |
XC06 | 03-Jul-09 | 29-Oct-09 |
XC06 | 16-Oct-09 | 11-Feb-10 |
X-BiCMOS 0.6 µm (*)
Process | Tape In | Samples Out |
|---|---|---|
XB06 | 07-Nov-08 | 19-Feb-09 |
XB06 | 13-Feb-09 | 28-May-09 |
XB06 | 05-Jun-09 | 17-Sep-09 |
XB06 | 18-Sep-09 | 30-Dec-09 |
XB06 | 20-Nov-09 | 04-Mar-10 |
X-SOI Trench Isolated CMOS 0.6 µm (*)
Process | Tape In | Samples Out |
|---|---|---|
XT06 | 23-Jan-09 | 12-Jun-09 |
XT06 | 17-Jul-09 | 03-Dec-09 |
X-CMOS 0.8 µm (*)
Process | Tape In | Samples Out |
|---|---|---|
CX08HW | 30-Jan-09 | 23-Apr-09 |
CX08 (without EEPROM) | 15-May-09 | 06-Aug-09 |
CX08 (without EEPROM) | 25-Sep-09 | 17-Dec-09 |
X-SOI CMOS 1 µm (*)
Process | Tape In | Samples Out |
|---|---|---|
XI10 | 27-Feb-09 | 26-May-09 |
XI10 | 21-Aug-09 | 17-Nov-09 |
X-DIMOS 1.0 µm (**)
Process | Tape In | Samples Out |
|---|---|---|
XDH10/XDM10 | 13-Mar-09 | 09-Jul-09 |
XDH10/XDM10 | 07-Aug-09 | 03-Dec-09 |
SOI-based Surface-Micro-Machining-Technology for inertial sensors (**)
Process | Tape In |
|---|---|
XM30 | on request |
Notes:
(*) highest process extension, all other sub variants of this process family included
(**) only dice in wafflepack possible
All changes to above schedule will be automatically updated on this web page only!
Please contact X-FAB before Tape in: sifo(at)xfab.com
