X-FAB Expands Analog Options for 0.6 µm BiCMOS Process FamilyErfurt, Germany, March 19, 2003.
X-FAB Group, the Erfurt, Germany-based mixed-signal foundry, has advanced the development of bipolar elements in its 0.6 µm BiCMOS process family and is offering, for the first time, One Time Programmable (OTP) storage functions. These new modules provide a series of advantages for analog applications, while also being fully compatible with the existing 0.6 µm BiCMOS process.
The new XB05 bipolar module, with a maximum frequency (Fmax) of 25 GHz, provides the optimal conditions for implementing applications with 2.4 GHz signal frequency. The advantage for applications which run at frequencies lower than 2.4 GHz is a considerable reduction in power consumption. Newly available, is a MIM (Metal-Insulator-Metal) capacitor. This capacitor's linearity is very high due to lower resistance resulting from two metal layers and a high-grade insulator layer. For the very first time, small to medium-sized EPROM storage for OTP memory can be integrated into the modular 0.6 µm BiCMOS process. The typical size of such EPROMs is 256 bytes.
All newly available technology modules are fully qualified, and the design kit for these new modules is available immediately. It utilizes Agilent's RF Design Environment (RFDE), which includes Agilent's Advanced Design System (ADS) high frequency simulators.
"The new modules not only expand the high-frequency, analog characteristics and programmability of the BiCMOS technology, but they are fully compatible with the earlier XB06 technology," said Jens Kosch, CTO at X-FAB Group. "In order to best exploit its functionality, the XB05 modules are a component of the expanded XB06 design kit. The new process options along with Agilent's design tools optimize the technical options we offer to our customers."
X-FAB, with headquarters in Erfurt, Germany, is a European, independent mixed-signal foundry. The company has - with X-FAB UK (Plymouth, UK) and sister company X-FAB Texas Inc. (Lubbock, Texas) - three manufacturing sites, with a combined capacity of more than 8,000 8-inch equivalent wafer starts per week. X-FAB has appr. 900 employees worldwide.