May 2003

X-FAB Expands Process Options for CMOS Technology

Photodiodes are available immediately for all CMOS processes

May 2003

X-FAB´s 0.6 µm CMOS Technology Enables Groundbreaking Process Flexibility

X-FAB Group, the mixed signal foundry based in Erfurt Germany, today announced the availability of sixteen (16) new process options for its 0.6 µm CMOS process family. Offering an unprecedented high level of flexibility, these processes can be combined in a modular fashion to fit specific 

March 2003

X-FAB Expands Analog Options for 0.6 µm BiCMOS Process Family

Improved bipolar module, MIM capacitors and OTP storage available

February 2003

X-FAB Expands MEMS Technologies to Include Inertial Sensors

With the release of a new technology for inertial sensors, customers of the X-FAB Group have immediate access to a new process generation in microelectromechanical systems (MEMS). X-FAB, the German-based, mixed-signal foundry, thus further solidifies its role as partner for development and volume 

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