November 2006

X-FAB to Release Design Kit for Its First Modular Analog/Mixed-Signal 0.18 um Process by End of Year

XC018 Master Kit for Cadence Supports CMOS Logic Low-Power Technology, Accelerates Development Time and Reduces Design Risks

 
October 2006

X-FAB Rolls Out RF-CMOS Program for Deep Sub-micron Communications Technologies

Two-Part Program with 0.35 Micron and 0.18 Micron RF-CMOS Processes Enables Efficient, Cost-Effective Combination of RF-CMOS with Full Line of Available Process Options including High-Voltage and Non-Volatile Memory

 
September 2006

X-FAB Semiconductor Foundries and 1st Silicon Complete Merger

X-FAB Silicon Foundries today announced completion of the merger of X-FAB Semiconductor Foundries AG with 1st Silicon (Malaysia) Sdn. Bhd.; the contracts became effective on Sept. 1, 2006. The extended X-FAB Group is organized under the umbrella of the Belgian holding X-FAB Silicon Foundries N.V., 

 
August 2006

X-FAB Reports Strong Growth in First Half of 2006

X-FAB Semiconductor Foundries AG, a leading manufacturer of analog/mixed-signal integrated circuits, has closed the first half of 2006 with a significant increase in sales and operating results.Consolidated sales were 89.7 million Euro (110.2 million US$), an increase of 16 percent compared to the 

 
August 2006

X-FAB Selects Cadence Solution for Maximum Yield

Cadence® Virtuoso® NeoCircuit DFM aids analysis, optimization for analog IP

 
May 2006

X-FAB Partners with Akustica to Deliver World`s First CMOS MEMS Single-Chip Microphones

X-FAB Partners with Akustica to Deliver World`s First CMOS MEMS Single-Chip Microphones X-FAB to provide foundry services for Akustica's family of CMOS MEMS silicon microphone chips Erfurt, Germany and Pittsburgh, PA; May 31, 2006: Akustica, Inc., a pioneer in acoustic system-on-chip solutions, 

 
May 2006

X-FAB Reduces Die Size with New Trench-Isolated SOI CMOS Technology

X-FAB Semiconductor Foundries AG, one of the world's leading analog mixed-signal semiconductor foundries, today announced XT06, its new 0.6 micrometer Silicon On Insulator (SOI) CMOS technology with trench isolation. This innovative process technology delivers X-FAB's modular, flexible 0.6