Failure Analysis

In the semiconductor and electronics industry, thorough failure analysis is a vital tool for the development of new products and the improvement of existing ones. X-FAB puts a lot of emphasis on systematically and speedily determining the cause of failure, collecting and analyzing data, and developing conclusions to eliminate the failure mechanism - in a constant endeavor to deliver reliable, best-quality products that fully satisfy its customers' expectations.

X-FAB's Failure Analysis encompasses all the stages of the product development and manufacturing process. It provides safe and fast root cause identification for:

  • Fab-process issues
  • Process Control Monitor (PCM) issues
  • Failed devices
  • Low yield issues

and supports qualification for:

  • New processes
  • New materials
  • New tools
  • Tool extension.