150 entries
Published: March 2011

Reliability is a critical performance factor for semiconductor technologies. This webinar describes the physical phenomena that can lead to device degradation during circuit operation, and deduces reliability models for CMOS technologies. These models can be used for design optimization (“Design for Reliability”) to enable very robust products, and for reliability risk assessment for advanced operating conditions such as high temperature and high voltage.


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Published: February 2011

The CX08 Series is X-FAB‘s 0.8 Micron Modular Mixed Signal Technology. Main target applications are standard cell, semi-custom and full custom designs for Industrial, Telecommunication and Automotive products - including the 42V board net.
Based on a state of the art single poly double metal 0.8-micron drawn gate length N-well process for digital application, various process modules are available for high performance analogue and high voltage circuits.


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Published: January 2011

Visualization is still the most important tool in medical diagnostics to allow for the physician, in combination with their medical knowledge, to detect diseases within the human body and choose healing treatments in order to enable recovery. For minimal invasive surgical operations that use endoscopic tools, imaging camera modules that have both a small volume and a good resolution are necessary to ensure the success of the surgical treatment.
Microsystem technologies now allow for the direct integration of imaging optics and sensors in a system.


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Published: January 2011

Miniaturized video endoscopes with an imager located at the distal end and a simplified opto-mechanical layout are presented. They are based on a CMOS imager with 650 x 650 pixels of 2.8 μm pitch and provide straight view with 75° and 110° field of view at f/4.3. They have an outer diameter of 3 mm including the shell and a length of approx. 8 mm. The optics consist of polymer lenses in combination with a GRIN and a dispensed lens. Using a simple flip chip assembly, optical axis alignment better than 10 μm and a contrast of 30 % at 90 LP/mm was achieved. The 75° FOV system was sealed at the front window using a solderjetting technology, providing 10-9 mbar*l/s leakage rates even after several autoclave cycles.


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Published: December 2010

This free webinar introduces X-FAB’s Hall effect sensor device that detects and measures magnetic fields directly on the chip, making magnetic field-sensing design much faster. You’ll learn how the Hall sensor element – available as a completely characterized building block in X-FAB’s 0.18 micrometer modular high-voltage technology, XH018 – can be combined with other features of the XH018 process to enable a broad range of applications. For example, contactless detection or measurement of magnetic fields, and applications in which a magnetic field is used for indirect measurement of distance, position, rotational angle, speed or an electric current.


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Published: December 2010

The CX06 Series is X-FAB‘s 0.6 Micron Modular Mixed Signal Technology. Main target applications are standard cell, semi-custom and full custom designs for Industrial, Automotive and Telecommunication products.
Based on a state of the art single poly double metal 0.6-micron drawn gate length N-well process for digital application, process modules are available for triple metal and double poly high performance analogue circuits.


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Published: November 2010

This paper suggests an improved method to round off the concave corners of the deep trenches formed by plasma etch. The corner rounding technique, sacrificial oxidation (SACOX) before gate oxidation, has been practiced on the shallow trench isolation (STI) to improve the CMOS leakage performance.


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Published: October 2010

In the past five years we have seen a huge step in the evolution of MEMS applications. Some may even call it a revolution. Traditionally, Inkjet printer heads and automotive applications have dominated MEMS volume production. Today, demand for MEMS is particularly high in the consumer and mobile sector with further applications appearing every day. Part of this MEMS revolution has been the changing requirements for associated ASIC CMOS intelligence. Many manufacturers who currently use discrete MEMS devices are now seeing the benefits of integrated CMOS.


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Published: August 2010

The XHB06 is X-FAB's 0.6 Micron High-Voltage Bipolar CMOS DMOS (BCD) Technology, optimized for applications requiring operating voltages of 5V to 30V. Main target applications are power management, RF circuits and high precision analog applications mixed with digital parts for Telecommunication, Consumer, Automotive and Industrial products. The digital part is fully compatible with X-CMOS 0.6 process family.


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Published: July 2010

Emerging applications in the field of lithium-ion battery management and Power over Ethernet require operating voltages of up to 100V, robust primitive devices and low on-resistance. X-FAB’s enhanced 0.35 micrometer high-voltage foundry process XH035 offers these features combined with high reliability and a small silicon footprint.


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