14 entries, filtered by: SoC
Published: August 2008

The XC018 series is X-FAB’s 0.18 micron Modular Logic and Mixed Signal Technology. The platfrom is ideal for SOC application. Main target applications are standard cell, semi-custom and full custom designs for Automotive, Consumer, Industrial as well as Telecommunication products, while the low power and high voltage process is ideal for mobile applications as well as display drivers or controllers. Based upon the industrial standard single poly with up to six metal layers 0.18-micron drawn gate length N-well process, modules are also available for metal-insulatormetal capacitors, high resistive poly, dual gate oxide (1.8V with 3.3V or 5.0V) transistors.


More
Published: January 2013

The XT018 series is X-FAB’s 0.18 micron Modular High-voltage SOI CMOS Technology. Based on SOI wafers and the industrial standard single poly with up to six metal layers 0.18-micron drawn gate length process, integrated with high voltage and Non-Volatile-Memory modules, the platform is specifically designed for a new generation of cost-effective "Super Smart Power" technology; operating in temperature range of -40 to 175 °C.


More
Published: September 2005

This paper presents the results of a three and a half year R&D project for low cost micromachined gyroscopes. As starting point of this work the application requirements of enhanced automotive applications such as Advanced Driving Assistant Systems (ADAS) are given. Based on these demands the sensor development is carried out.


More
Published: June 2006

An original work in developing technology that allows the integration of multiple vertical power devices within Power ICs has been presented in this manuscript. The developed technology uses a combination of top and back trenches as well as wafer sawing to achieve complete dielectric isolation between the silicon islands. Each silicon island is capable of holding either single vertical power device or CMOS circuitry. The test structures have been manufactured, wafer diced and individual chips packaged and tested initially for mechanical and thermal stability.


More
Published: September 2006

An infrared focal plane array with 16 x 8 pixels is presented. The not-cooled thermopile sensor array has been completely fabricated in CMOS technology. The main field of application of this sensor is to detect the presence of persons in buildings by their own thermal radiation. For a wide spread use of this sensor a low cost production with established CMOS technologies is necessary. The chip embraces the sensor pixels and highly integrated electronic circuits to allow a simple sensor interfacing.


More
Published: May 2007

A new smart power SOC IC process including up to 50V HV-MOS transistors, SONOS principle based non-volatile memory components and analog devices using an advanced 0.18μm platform is presented. Process architecture and device portfolio are focused on automotive applications e.g. sensor signal conditioning and integrated output drivers. HV-MOS and SONOS integration as well as device properties are discussed with regard to reliability aspects. Additionally key features of NPN bipolar transistors and depletion NMOST are given.


More
Published: May 2008

The snapback trigger voltage of the NDMOS in a 0.18μm automotive smart power technology is strongly reduced at large gate bias. This behavior of the deep-submicron multiresurf NDMOS, which makes its ESD protection difficult and limits its electrical safe operating area, and the influence of various device modifications are investigated by TCAD simulation. SCR-based ESD protection schemes for I/O and power supply protection are presented. For supply protection the SCR is modified to increase its holding voltage. The ability to protect the NDMOS at non-zero gate bias is discussed.


More
Published: July 2008

In this paper, a 40V versatile HV LDMOS technology with lower Rdson has been developed in the existing 0.18μm LV CMOS process. The HV LDMOS are designed by using DOE concept on the simulation results from T-supreme followed by Medici.


More
Published: August 2009

In SOC (System on Chip) technology, the various types of devices located on an IC chip typically have different operating voltages thus requiring multiple gate oxide layers of different thickness to be formed. In order to form different gate oxide, several oxide removal and growth steps have to be carried out which make the process more complex and particularly have a detrimental impact on the Shallow Trench Isolation (STI) structures.


More
Published: January 2011

Visualization is still the most important tool in medical diagnostics to allow for the physician, in combination with their medical knowledge, to detect diseases within the human body and choose healing treatments in order to enable recovery. For minimal invasive surgical operations that use endoscopic tools, imaging camera modules that have both a small volume and a good resolution are necessary to ensure the success of the surgical treatment.
Microsystem technologies now allow for the direct integration of imaging optics and sensors in a system.


More