34 entries, filtered by: Analog
Published: July 2008

The XC06 Series completes X-FAB‘s 0.6 Micron Modular Mixed Signal Technology with embedded Non Volatile Memory and High Voltage options. EEPROM blocks up to 32 kbit as well as Flash memories up to 512 kbit can be integrated in standard cell, semi-custom and full custom designs for Industrial, Automotive and Telecommunication products.
MOS as well as Bipolar Transistors are available with Breakdown Voltages up to 100V. The 5 V CMOS core is compatible in Design Rules and Transistor Performance with state of the art 0.6 μm CMOS Processes.
For analog applications several capacitor and resistor devices are realized, using the Double-Poly-Non-Volatile-Memory architecture.


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Published: July 2008

The XC10 Series is X-FAB‘s One-Micron Modular Mixed Signal Technology. Main target applications are standard cell, semi-custom and full custom designs for Automotive, Consumer, Industrial and Telecommunication products. The process enables mixed-signal systems on one chip by its nonvolatile memory and sensor integration capabilities.
Based on a state of the art very cost effective single poly single metal 1.0-micron minimum feature size N-well process for mixed-signal and high voltage applications, various process modules are available for high performance analog and high voltage circuits. Using the non-volatile memory modules integration of EEPROM, OTP or NV latches is possible.
Technology variants for integrated MEMS are available.


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Published: January 2009

The XB06 Series is X-FAB‘s 0.6 Micron BiCMOS Technology. Main target applications are RF circuits and high precision analog applications mixed with digital parts for Telecommunication, Consumer, Automotive and Industrial products. The digital part is fully compatible with X-CMOS 0.6 process family.


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Published: August 2010

The XHB06 is X-FAB's 0.6 Micron High-Voltage Bipolar CMOS DMOS (BCD) Technology, optimized for applications requiring operating voltages of 5V to 30V. Main target applications are power management, RF circuits and high precision analog applications mixed with digital parts for Telecommunication, Consumer, Automotive and Industrial products. The digital part is fully compatible with X-CMOS 0.6 process family.


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Published: December 2010

The CX06 Series is X-FAB‘s 0.6 Micron Modular Mixed Signal Technology. Main target applications are standard cell, semi-custom and full custom designs for Industrial, Automotive and Telecommunication products.
Based on a state of the art single poly double metal 0.6-micron drawn gate length N-well process for digital application, process modules are available for triple metal and double poly high performance analogue circuits.


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Published: February 2011

The CX08 Series is X-FAB‘s 0.8 Micron Modular Mixed Signal Technology. Main target applications are standard cell, semi-custom and full custom designs for Industrial, Telecommunication and Automotive products - including the 42V board net.
Based on a state of the art single poly double metal 0.8-micron drawn gate length N-well process for digital application, various process modules are available for high performance analogue and high voltage circuits.


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Published: April 2011

The XT06 Series completes X-FAB's 0.6 Micron Modular Mixed Signal Technology.
XT06 uses dielectric isolation on SOI wafers. This allows unrestricted 60 V high and low side operation of all devices. The process offers reduced parasitics which results in smaller crosstalk, reduced noise and better EMC characteristics. Thus XT06 allows innovative circuit design with reduced circuit complexity. CMOS as well as Bipolar Transistors are available with breakdown voltages up to 110V.
The 5 V CMOS core is compatible in design rules and transistor performance with state of the art 0.6μm CMOS processes.
For analog applications several capacitor and resistor devices are realized, using the double-poly architecture.


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Published: June 2011

XO035 is X-FAB’s specialized process for optoelectronic and high speed RF applications. It is especially suited for applications needing sensitive high bandwidth photo diodes arrays or CMOS image sensors for such applications as optical data storage, optical data communication or high dynamic range cameras.


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Published: June 2012

The XU035 series is X-FAB’s 0.35-micrometer Modular 700V Ultra-High-Voltage (UHV) Technology. Based upon the standard 1P3M process with single 5V gate oxide, 0.35-micron drawn gate length and metal design rules, the platform is engineered for applications needing an integrated power and startup device solution.


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Published: December 2012

The XH018 series is X-FAB’s 0.18 micron Modular Mixed Signal HV CMOS Technology. Based upon the industrial standard single poly with up to six metal layers 0.18 micron drawn gate length N-well process, integrated with highvoltage and Non-Volatile-Memory modules, the platform is ideal for SOC applications in the automotive market, as well as emdedded high-voltage applications in the communications, consumer and industrial market.
Comprehensive design rules, precise SPICE models, analog and digital libraries, IPs and development kits support the process for major EDA vendors.


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