At high temperature, designers are faced with additional technological and design challenges. These issues and how to address them are discussed in this presentation. The webinar looks at X-FAB's high temperature solutions, in particular its latest High Temperature Modular CMOS process (XA035), a comprehensive CMOS offering with High Voltage (HV), RF, and EEPROM integration that is suitable for temperatures up to 175C. The presentation also covers high temperature modelling, application specific reliability and design for reliability.
The feasibility of EEPROM memories in SOI process technologies has been proven. It has also been shown that known data retention problems at high temperatures caused by leakage currents can be solved without extra circuitry. In this paper results of EEPROM cell matrix measurements regarding functionality and reliability will be presented. Different cell designs will be compared. Furthermore, a 32x16 bit EEPROM prototype and memory test results will be shown.