14 entries, filtered by: SoC
Published: May 2007

A new smart power SOC IC process including up to 50V HV-MOS transistors, SONOS principle based non-volatile memory components and analog devices using an advanced 0.18μm platform is presented. Process architecture and device portfolio are focused on automotive applications e.g. sensor signal conditioning and integrated output drivers. HV-MOS and SONOS integration as well as device properties are discussed with regard to reliability aspects. Additionally key features of NPN bipolar transistors and depletion NMOST are given.


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Published: September 2006

An infrared focal plane array with 16 x 8 pixels is presented. The not-cooled thermopile sensor array has been completely fabricated in CMOS technology. The main field of application of this sensor is to detect the presence of persons in buildings by their own thermal radiation. For a wide spread use of this sensor a low cost production with established CMOS technologies is necessary. The chip embraces the sensor pixels and highly integrated electronic circuits to allow a simple sensor interfacing.


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Published: June 2006

An original work in developing technology that allows the integration of multiple vertical power devices within Power ICs has been presented in this manuscript. The developed technology uses a combination of top and back trenches as well as wafer sawing to achieve complete dielectric isolation between the silicon islands. Each silicon island is capable of holding either single vertical power device or CMOS circuitry. The test structures have been manufactured, wafer diced and individual chips packaged and tested initially for mechanical and thermal stability.


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Published: September 2005

This paper presents the results of a three and a half year R&D project for low cost micromachined gyroscopes. As starting point of this work the application requirements of enhanced automotive applications such as Advanced Driving Assistant Systems (ADAS) are given. Based on these demands the sensor development is carried out.


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