1.0 Micron Modular Mixed Signal Technology
Logic
Analog M/S
NVM
Opto
High Voltage
MEMS
The XC10 Series is X-FAB's one micrometer Modular Mixed Signal Technology. Main target applications are standard cell, semi-custom and full custom designs for automotive, consumer, industrial and telecommunication products. The process enables mixed signal systems on one chip due to its non-volatile memory and sensor integration capabilities. Based on a state-of-the-art very cost effective single poly single metal 1.0 µm minimum feature size N-well process for mixed signal and high voltage applications, various process modules are available for high performance analog and high voltage circuits. Using the non-volatile memory modules integration of EEPROM, OTP or NV latches is possible. Technology variants for integrated MEMS are also available.
Available Modules
Standard 5V or Low Voltage 1.5V CMOS Core Module (1P1M)
Depletion Implant Module
Depletion Transistor Module
Double Poly Capacitor/(high resistor/low T.C.) Resistor Module
High Voltage PMOS Module
ESD Implant Module
2 Metals Layer Module
Thick Second Metal Module
EEPROM Module
EPROM Module
Optical Window Module
Relative Pressure Sensor Module
Absolute Pressure Sensor Module
