Main process features:

• KOH etch with electrochemical etch stop for discrete version
• Time-controlled KOH etch for monolithic integrated version
• Implanted piezoresistors
• Fully characterized sensor IP blocks available for pressure ranges up to 0.5 bar, 1 bar, 6 bar, 10 bar and 15 bar (see infosheet)
• customer specific pressure sensors available on request
• Integrated version: available as MEMS module for integration with X-FAB CMOS technology XC10 (see infosheet)