Senior Process Engineer - OPC (Photolithography)

Job Summary:
Responsible to develop, maintain, and improve OPC to achieve required pattering performance target.

Major Responsibilities:

• OPC development
  • OPC scheme setup for a new technology when necessary
  • Optimized OPC model construction for model-based OPC layers
  • Standard run-set script preparation including special control of specific features
• OPC maintenance
  • Standard OPC execution including pre- and post-OPC data handling
  • Post-OPC data verification
  • Support special requests from internal/external customers by customizing OPC scheme
• OPC improvement
  • Managing verification procedure on the wafer with OPC performance target
  • Monitoring on parameters affecting OPC performance and OPC update if needed
  • OPC verification tool evaluation and setup

Requirements:

• Qualification: Minimum Bachelor’s Degree in Engineering or Science.
• Minimum 3 years of relevant experience in semiconductor, particularly OPC field.
• Proficient in wafer fabrication application software.
• Understanding on Photolithography process and equipment is a pre-requisite.
• Good understanding on basic concept of semiconductor fabrication.
• Excellent analytical and problem solving skills.
• Good  interpersonal and communication skills.
• Good leadership skills and able to work independently.
• Highly pro-active and team player.

Location:

Based in X-FAB Sarawak (Kuching, Malaysia)

Contact Details:

The Recruitment Team
X-FAB Sarawak Sdn. Bhd.
1 Silicon Drive, Sama Jaya Free Industrial Zone
93350 Kuching, Sarawak, Malaysia.
Tel:  +60 82 354 888
Fax: +60 82 263 330
or
Email: hr.kch(at)xfab.com