五月 2005 X-FAB Extends MEMS Platform Pressure Sensor IP Cores and SOI-MEMS Now Available
X-FAB Semiconductor Foundries AG, the leading mixed-signal foundry specialist is now offering IP cores for MEMS pressure sensor technologies. With this novel concept X-FAB supports foundry customers who are designing single chip solutions where the piezoresistive pressure sensor is integrated with
五月 2005 1st Silicon Completes Qualification and Starts Production with Sharp Corporation for 0.13µm NOR Flash Technology
1st Silicon (Malaysia) Sdn. Bhd., a premier semiconductor-manufacturing foundry, announced that it has completed qualification and begun production shipment of Sharp Corporation's 0.13µm NOR Flash technology. Today's announcement represents a major milestone for the company.
The
五月 2005 X-FAB announces record sales and earnings for 2004
Positive development of sales and earnings in the first quarter of '05
四月 2005 1st Silicon Wins Certification, Award for Information Security Management System and Environmental Reporting
British Standard certification and Malaysia ACCA commendation are significant international awards
三月 2005 X-FAB Collaborates with Cadence to Accelerate Analog and Mixed-Signal Designs
Leading Independent Foundry and EDA Supplier Work Together To Deliver Process Design Kits to Lower Customer Development Time and Costs
二月 2005 1st Silicon Begins Production Shipments of 0.25µm Embedded Flash Technology
1st Silicon (Malaysia) Sdn. Bhd., a premier semiconductor-manufacturing foundry, announced that it has completed qualification and begun production shipment of 0.25µm embedded flash technology. Today's announcement meets a goal set by the Company last summer to have production services ready in the
一月 2005 ZMD/ZFOUNDRY and 1st Silicon Enter Strategic Partnership for Sourcing and Developing Advanced Automotive Technologies
The joint program combines ZMD's established expertise in automotive design, high-voltage processes and quality manufacturing with the advanced process know-how and production capabilities of 1st Silicon. This collaboration will ultimately result in a versatile 0.18µm process platform for
