0.35 Micron High Temperature Modular Mixed Signal Technology
The XA035 Series is X-FAB‘s 0.35 Micron High Temperature CMOS Technology. Main target applications are high temperature automotive and Industrial products with temperature range up to 175ºC. Best suited for high temperature automotive applications, the XA035 is also targeted at industiral, medical and avionic markets. All modules are comparable in Design Rules and Transistor Performance with our corporate state of the art 0.35 μm CMOS Processes.
Comprehensive design rules, precise SPICE models, analog and digital libraries, IP’s and development kits support the process on platforms supplied by the major EDA tool vendors.
- Standard 3.3V Core Module (1P3M)
- Isolated MOS Module
- Thick Gate Oxide Module
- Depletion NMOS Module
- Buried N Module
- Double Polysilicon Capacitor Module
- High Resistivity Polysilicon Module
- Very High Resistivity Polysilicon Module
- TEEPROM Module
- Single or Double MIM Capacitor Module
- 2 Metals Layer Module
- 4 Metals Layer Module
- Thick Top Metal Module