三月 2012

X-FAB 在0.18um工艺平台扩展高温的功能并结合高压、高温、与非挥发性内存的特点

XH018高温工艺对新的应用领域增加了多个新式且功能强大的器件

 
二月 2012

X-FAB Uses Silicon Frontline’s Post-Layout Extraction Software to Enhance its Advanced Mixed-Signal Process Design Kit

Use of SFT’s R3D software for XH018 process design kit improves high-voltage and driver characteristics of mixed-signal SOC designs

 
十一月 2011

X-FAB拓展0.18um技术平台着重高能效系统

结合新式60V高压技术与嵌入式闪存的工艺 以智能型电源管理芯片推动新一代的功率控制方案

 
十月 2011

CEITEC S.A. Announces Volume Production of the Chip do Boi Device

RFID Device becomes Brazils First Homegrown Chip to Reach Mass Manufacturing at X-FAB

 
十月 2011

X-FAB and Senodia Bring MEMS Gyroscopes to China

Senodia selects X-FAB as MEMS foundry for high-volume production of single- and 3-axis gyroscopes

 
十月 2011

X-FAB Qualifies Cadence Physical Verification System for All Process Nodes

Customers of Leading Mixed-Signal Foundry Group Reap Benefits of In-Design Physical Verification Integrated with Cadence Encounter and Virtuoso Technologies

 
九月 2011

X-FAB Extends High-Temperature Foundry Offering to Enable Emerging Power Management Applications

XA035 becomes the first process to support combination of 100V operating voltages and 175 degrees Celsius operating temperature, enabling...

 
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