十月 2011

CEITEC S.A. Announces Volume Production of the Chip do Boi Device

RFID Device becomes Brazils First Homegrown Chip to Reach Mass Manufacturing at X-FAB

 
十月 2011

X-FAB and Senodia Bring MEMS Gyroscopes to China

Senodia selects X-FAB as MEMS foundry for high-volume production of single- and 3-axis gyroscopes

 
十月 2011

X-FAB Qualifies Cadence Physical Verification System for All Process Nodes

Customers of Leading Mixed-Signal Foundry Group Reap Benefits of In-Design Physical Verification Integrated with Cadence Encounter and Virtuoso Technologies

 
九月 2011

X-FAB Extends High-Temperature Foundry Offering to Enable Emerging Power Management Applications

XA035 becomes the first process to support combination of 100V operating voltages and 175 degrees Celsius operating temperature, enabling...

 
八月 2011

X-FAB and Micronas join in strategic partnership

Collaboration as foundry and technology partners for the 0.18 µm high-voltage CMOS process with embedded flash results in Micronas acquiring a stake in X-FAB

 
七月 2011

X-FAB 0.18um高压工艺提供嵌入式闪存(eFlash)

XH018 嵌入式闪存(eFlash) 工艺为高阶系统芯片(SoCs)提供业界最具性价比 的高压整合方案

 
六月 2011

X-FAB Releases Ready-to-Use Design IP Blocks for MEMS Accelerometers

Achieves industry’s fastest development times for accelerometers with combination of new IP and X-FAB-proven inertial sensor process

 
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